MCP1825/MCP1825S
3-Lead Plastic Transistor Outline (AB) [TO-220]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
CHAMFER
E
A
OPTIONAL
P
A1
φ
Q
H1
D
D1
L1
L
b2
2
N
1
b
c
e
A2
e1
Units
INCHES
Dimension Limits
MIN
NOM
MAX
Number of Pins
Pitch
N
e
3
.100 BSC
Overall Pin Pitch
Overall Height
Tab Thickness
Base to Lead
Overall Width
e1
A
.200 BSC
.140
.020
.080
.357
.100
.560
.330
.230
.139
.500
–
–
–
.190
.055
.115
.420
.120
.650
.355
.270
.156
.580
.250
.024
.040
.070
A1
A2
E
–
–
Mounting Hole Center
Overall Length
Q
–
D
–
Molded Package Length
Tab Length
D1
H1
φP
L
–
–
Mounting Hole Diameter
Lead Length
–
–
Lead Shoulder
L1
c
–
Lead Thickness
Lead Width
.012
.015
.045
–
b
.027
.057
Shoulder Width
b2
Notes:
1. Dimensions D and E do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" per side.
2. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-034B
DS22056B-page 28
© 2008 Microchip Technology Inc.
MICROCHIP [ MICROCHIP ]
