MCP1825/MCP1825S
3-Lead Plastic (EB) [DDPAK]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
E
E1
L1
D
D1
H
1
N
b
e
BOTTOM VIEW
TOP VIEW
b1
CHAMFER
OPTIONAL
C2
A
φ
c
L
A1
Units
INCHES
Dimension Limits
MIN
NOM
MAX
Number of Pins
Pitch
N
e
3
.100 BSC
Overall Height
Standoff §
A
.160
.000
.380
.245
.330
.549
.270
.014
.045
.020
.045
.068
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
.190
.010
.420
–
A1
E
Overall Width
Exposed Pad Width
E1
D
Molded Package Length
Overall Length
.380
.625
–
H
Exposed Pad Length
Lead Thickness
Pad Thickness
Lower Lead Width
Upper Lead Width
Foot Length
D1
c
.029
.065
.039
.070
.110
.067
8°
C2
b
b1
L
Pad Length
L1
φ
Foot Angle
0°
Notes:
1. § Significant Characteristic.
2. Dimensions D and E do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" per side.
3. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-011B
© 2008 Microchip Technology Inc.
DS22056B-page 25
MICROCHIP [ MICROCHIP ]
