MCP1825/MCP1825S
3-Lead Plastic Small Outline Transistor (DB) [SOT-223]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
b2
E1
E
3
2
1
e
e1
A2
c
A
φ
b
L
A1
Units
MILLIMETERS
Dimension Limits
MIN
NOM
MAX
Number of Leads
Lead Pitch
N
e
3
2.30 BSC
4.60 BSC
–
Outside Lead Pitch
Overall Height
Standoff
e1
A
–
1.80
0.10
1.70
7.30
3.70
6.70
0.35
0.84
3.10
–
A1
A2
E
0.02
1.50
6.70
3.30
6.30
0.23
0.60
2.90
0.75
0°
–
Molded Package Height
Overall Width
1.60
7.00
3.50
6.50
0.30
0.76
3.00
–
Molded Package Width
Overall Length
Lead Thickness
Lead Width
E1
D
c
b
Tab Lead Width
Foot Length
b2
L
Lead Angle
φ
–
10°
Notes:
1. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.127 mm per side.
2. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-032B
DS22056B-page 26
© 2008 Microchip Technology Inc.
MICROCHIP [ MICROCHIP ]
