MCP1825/MCP1825S
5-Lead Plastic Transistor Outline (AT) [TO-220]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
A
E
φP
CHAMFER
OPTIONAL
A1
Q
H1
D
D1
L
N
1
2
3
e
c
b
e1
A2
Units
INCHES
Dimension Limits
MIN
NOM
MAX
Number of Pins
Pitch
N
e
5
.067 BSC
Overall Pin Pitch
Overall Height
Overall Width
Overall Length
e1
A
.268 BSC
.140
.380
.560
.330
.204
.020
.100
.139
.482
.080
.012
.015
–
–
.190
.420
.650
.355
.293
.055
.120
.156
.590
.115
.025
.040
E
D
–
Molded Package Length
Tab Length
D1
H1
A1
Q
–
–
Tab Thickness
–
Mounting Hole Center
Mounting Hole Diameter
Lead Length
–
φP
L
–
–
Base to Bottom of Lead
Lead Thickness
A2
c
–
–
Lead Width
b
.027
Notes:
1. Dimensions D and E do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" per side.
2. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-036B
DS22056B-page 32
© 2008 Microchip Technology Inc.
MICROCHIP [ MICROCHIP ]
