MCP1727
8-Lead Plastic Dual Flat, No Lead Package (MF) – 3x3x0.9 mm Body [DFN]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
e
D
b
N
N
L
EXPOSED PAD
E
E2
K
NOTE 1
NOTE 1
1
2
2
1
D2
BOTTOM VIEW
TOP VIEW
A
NOTE 2
A3
A1
Units
MILLIMETERS
NOM
Dimension Limits
MIN
MAX
Number of Pins
Pitch
N
e
8
0.65 BSC
0.90
Overall Height
Standoff
A
0.80
0.00
1.00
0.05
A1
A3
D
0.02
Contact Thickness
Overall Length
Exposed Pad Width
Overall Width
0.20 REF
3.00 BSC
–
E2
E
0.00
1.60
3.00 BSC
–
Exposed Pad Length
Contact Width
Contact Length
Contact-to-Exposed Pad
D2
b
0.00
0.25
0.20
0.20
2.40
0.35
0.55
–
0.30
L
0.30
K
–
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package may have one or more exposed tie bars at ends.
3. Package is saw singulated.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-062B
DS21999B-page 24
© 2007 Microchip Technology Inc.
MICROCHIP [ MICROCHIP ]
