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93C465AT-E/MC 参数 Datasheet PDF下载

93C465AT-E/MC图片预览
型号: 93C465AT-E/MC
PDF下载: 下载PDF文件 查看货源
内容描述: 1K - 16K与Microwire兼容串行EEPROM [1K-16K Microwire Compatible Serial EEPROMs]
分类和应用: 可编程只读存储器电动程控只读存储器电可擦编程只读存储器
文件页数/大小: 38 页 / 703 K
品牌: MICROCHIP [ MICROCHIP ]
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93XX46X/56X/66X/76X/86X  
8-Lead Plastic Dual Flat, No Lead Package (MC) – 2x3x0.9 mm Body [DFN]  
Note: For the most current package drawings, please see the Microchip Packaging Specification located at  
http://www.microchip.com/packaging  
e
D
b
N
N
L
K
E2  
E
EXPOSED PAD  
NOTE 1  
NOTE 1  
2
1
1
2
D2  
BOTTOM VIEW  
TOP VIEW  
A
NOTE 2  
A3  
A1  
Units  
MILLIMETERS  
Dimension Limits  
MIN  
NOM  
8
MAX  
Number of Pins  
Pitch  
N
e
0.50 BSC  
0.90  
Overall Height  
Standoff  
A
0.80  
0.00  
1.00  
0.05  
A1  
A3  
D
0.02  
Contact Thickness  
Overall Length  
Overall Width  
0.20 REF  
2.00 BSC  
3.00 BSC  
E
Exposed Pad Length  
Exposed Pad Width  
Contact Width  
Contact Length  
Contact-to-Exposed Pad  
D2  
E2  
b
1.30  
1.50  
0.18  
0.30  
0.20  
1.75  
1.90  
0.30  
0.50  
0.25  
L
0.40  
K
Notes:  
1. Pin 1 visual index feature may vary, but must be located within the hatched area.  
2. Package may have one or more exposed tie bars at ends.  
3. Package is saw singulated.  
4. Dimensioning and tolerancing per ASME Y14.5M.  
BSC: Basic Dimension. Theoretically exact value shown without tolerances.  
REF: Reference Dimension, usually without tolerance, for information purposes only.  
Microchip Technology Drawing C04-123B  
DS21929D-page 28  
© 2007 Microchip Technology Inc.  
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