欢迎访问ic37.com |
会员登录 免费注册
发布采购

93C465AT-E/MC 参数 Datasheet PDF下载

93C465AT-E/MC图片预览
型号: 93C465AT-E/MC
PDF下载: 下载PDF文件 查看货源
内容描述: 1K - 16K与Microwire兼容串行EEPROM [1K-16K Microwire Compatible Serial EEPROMs]
分类和应用: 可编程只读存储器电动程控只读存储器电可擦编程只读存储器
文件页数/大小: 38 页 / 703 K
品牌: MICROCHIP [ MICROCHIP ]
 浏览型号93C465AT-E/MC的Datasheet PDF文件第23页浏览型号93C465AT-E/MC的Datasheet PDF文件第24页浏览型号93C465AT-E/MC的Datasheet PDF文件第25页浏览型号93C465AT-E/MC的Datasheet PDF文件第26页浏览型号93C465AT-E/MC的Datasheet PDF文件第28页浏览型号93C465AT-E/MC的Datasheet PDF文件第29页浏览型号93C465AT-E/MC的Datasheet PDF文件第30页浏览型号93C465AT-E/MC的Datasheet PDF文件第31页  
93XX46X/56X/66X/76X/86X  
8-Lead Plastic Small Outline (SN or OA) – Narrow, 3.90 mm Body [SOIC]  
Note: For the most current package drawings, please see the Microchip Packaging Specification located at  
http://www.microchip.com/packaging  
D
e
N
E
E1  
NOTE 1  
1
2
3
α
h
b
h
c
φ
A2  
A
L
A1  
L1  
β
Units  
MILLIMETERS  
Dimension Limits  
MIN  
NOM  
MAX  
Number of Pins  
Pitch  
N
e
8
1.27 BSC  
Overall Height  
A
1.75  
Molded Package Thickness  
Standoff  
A2  
A1  
E
1.25  
0.10  
§
0.25  
Overall Width  
6.00 BSC  
Molded Package Width  
Overall Length  
Chamfer (optional)  
Foot Length  
E1  
D
h
3.90 BSC  
4.90 BSC  
0.25  
0.40  
0.50  
1.27  
L
Footprint  
L1  
φ
1.04 REF  
Foot Angle  
0°  
0.17  
0.31  
5°  
8°  
Lead Thickness  
Lead Width  
c
0.25  
0.51  
15°  
b
Mold Draft Angle Top  
Mold Draft Angle Bottom  
α
β
5°  
15°  
Notes:  
1. Pin 1 visual index feature may vary, but must be located within the hatched area.  
2. § Significant Characteristic.  
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.  
4. Dimensioning and tolerancing per ASME Y14.5M.  
BSC: Basic Dimension. Theoretically exact value shown without tolerances.  
REF: Reference Dimension, usually without tolerance, for information purposes only.  
Microchip Technology Drawing C04-057B  
© 2007 Microchip Technology Inc.  
DS21929D-page 27  
 复制成功!