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93C465AT-E/MC 参数 Datasheet PDF下载

93C465AT-E/MC图片预览
型号: 93C465AT-E/MC
PDF下载: 下载PDF文件 查看货源
内容描述: 1K - 16K与Microwire兼容串行EEPROM [1K-16K Microwire Compatible Serial EEPROMs]
分类和应用: 可编程只读存储器电动程控只读存储器电可擦编程只读存储器
文件页数/大小: 38 页 / 703 K
品牌: MICROCHIP [ MICROCHIP ]
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93XX46X/56X/66X/76X/86X  
8-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm Body [TSSOP]  
Note: For the most current package drawings, please see the Microchip Packaging Specification located at  
http://www.microchip.com/packaging  
D
N
E
E1  
NOTE 1  
1
2
b
e
c
φ
A
A2  
A1  
L
L1  
Units  
MILLIMETERS  
Dimension Limits  
MIN  
NOM  
MAX  
Number of Pins  
Pitch  
N
e
8
0.65 BSC  
Overall Height  
A
1.20  
1.05  
0.15  
Molded Package Thickness  
Standoff  
A2  
A1  
E
0.80  
0.05  
1.00  
Overall Width  
6.40 BSC  
Molded Package Width  
Molded Package Length  
Foot Length  
E1  
D
4.30  
2.90  
0.45  
4.40  
4.50  
3.10  
0.75  
3.00  
L
0.60  
Footprint  
L1  
φ
1.00 REF  
Foot Angle  
0°  
8°  
Lead Thickness  
c
0.09  
0.20  
0.30  
Lead Width  
b
0.19  
Notes:  
1. Pin 1 visual index feature may vary, but must be located within the hatched area.  
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.  
3. Dimensioning and tolerancing per ASME Y14.5M.  
BSC: Basic Dimension. Theoretically exact value shown without tolerances.  
REF: Reference Dimension, usually without tolerance, for information purposes only.  
Microchip Technology Drawing C04-086B  
© 2007 Microchip Technology Inc.  
DS21929D-page 31  
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