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93C465AT-E/MC 参数 Datasheet PDF下载

93C465AT-E/MC图片预览
型号: 93C465AT-E/MC
PDF下载: 下载PDF文件 查看货源
内容描述: 1K - 16K与Microwire兼容串行EEPROM [1K-16K Microwire Compatible Serial EEPROMs]
分类和应用: 可编程只读存储器电动程控只读存储器电可擦编程只读存储器
文件页数/大小: 38 页 / 703 K
品牌: MICROCHIP [ MICROCHIP ]
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93XX46X/56X/66X/76X/86X  
8-Lead Plastic Dual In-Line (P or PA) – 300 mil Body [PDIP]  
Note: For the most current package drawings, please see the Microchip Packaging Specification located at  
http://www.microchip.com/packaging  
N
NOTE 1  
E1  
3
1
2
D
E
A2  
A
L
A1  
c
e
eB  
b1  
b
Units  
INCHES  
Dimension Limits  
MIN  
NOM  
8
MAX  
Number of Pins  
Pitch  
N
e
.100 BSC  
Top to Seating Plane  
A
.210  
.195  
Molded Package Thickness  
Base to Seating Plane  
Shoulder to Shoulder Width  
Molded Package Width  
Overall Length  
A2  
A1  
E
.115  
.015  
.290  
.240  
.348  
.115  
.008  
.040  
.014  
.130  
.310  
.250  
.365  
.130  
.010  
.060  
.018  
.325  
.280  
.400  
.150  
.015  
.070  
.022  
.430  
E1  
D
Tip to Seating Plane  
Lead Thickness  
L
c
Upper Lead Width  
b1  
b
Lower Lead Width  
Overall Row Spacing §  
eB  
Notes:  
1. Pin 1 visual index feature may vary, but must be located with the hatched area.  
2. § Significant Characteristic.  
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.  
4. Dimensioning and tolerancing per ASME Y14.5M.  
BSC: Basic Dimension. Theoretically exact value shown without tolerances.  
Microchip Technology Drawing C04-018B  
DS21929D-page 26  
© 2007 Microchip Technology Inc.  
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