PIC12CE67X
Package Type: K04-084 8-Lead Ceramic Side Brazed Dual In-line with Window (JW) – 300 mil
E
W
T
D
2
1
n
U
A
A1
L
A2
c
B1
p
eB
B
Units
MILLIMETERS
INCHES*
NOM
0.300
8
Dimension Limits
PCB Row Spacing
Number of Pins
Pitch
Lower Lead Width
Upper Lead Width
Lead Thickness
Top to Seating Plane
Top of Body to Seating Plane
Base to Seating Plane
Tip to Seating Plane
Package Length
MIN
MAX
MIN
NOM
7.62
8
MAX
n
p
B
B1
c
0.098
0.016
0.050
0.008
0.145
0.103
0.025
0.130
0.510
0.280
0.310
0.161
0.440
0.260
0.100
0.018
0.055
0.010
0.165
0.123
0.035
0.140
0.520
0.290
0.338
0.166
0.450
0.270
0.102
2.49
0.41
2.54
0.46
1.40
0.25
4.19
3.12
0.89
3.56
13.21
7.37
8.57
4.22
11.43
6.86
2.59
0.020
0.060
0.012
0.185
0.143
0.045
0.150
0.530
0.300
0.365
0.171
0.460
0.280
0.51
1.52
0.30
4.70
3.63
1.14
3.81
13.46
7.62
9.27
4.34
11.68
7.11
1.27
0.20
3.68
2.62
0.64
3.30
12.95
7.11
7.87
4.09
11.18
6.60
A
A1
A2
L
D
E
eB
W
T
Package Width
Overall Row Spacing
Window Diameter
Lid Length
Lid Width
U
* Controlling Parameter.
1998 Microchip Technology Inc.
Preliminary
DS40181B-page 105
MICROCHIP [ MICROCHIP ]
