PIC12CE67X
14.0 PACKAGING INFORMATION
14.1
Package Marking Information
8-Lead PDIP (300 mil)
Example
12CE674
MMMMMMMM
XXXXXCDE
04/PSAZ
AABB
9725
Example
8-Lead Windowed Ceramic Side Brazed (300 mil)
JW
MM
CE674
MMMMMM
Legend: MM...M Microchip part number information
XX...X Customer specific information*
AA
BB
C
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Facility code of the plant at which wafer is manufactured
O = Outside Vendor
C = 5” Line
S = 6” Line
H = 8” Line
D
E
Mask revision number
Assembly code of the plant or country of origin in which
part was assembled
Note: In the event the full Microchip part number cannot be marked on one line,
it will be carried over to the next line thus limiting the number of available
characters for customer specific information.
*
Standard OTP marking consists of Microchip part number, year code, week
code, facility code, mask rev#, and assembly code. For OTP marking
beyond this, certain price adders apply. Please check with your Microchip
Sales Office. For QTP devices, any special marking adders are included in
QTP price.
1998 Microchip Technology Inc.
Preliminary
DS40181B-page 103
MICROCHIP [ MICROCHIP ]
