PIC12CE67X
Package Type: K04-018 8-Lead Plastic Dual In-line (P) – 300 mil
E
D
2
1
n
α
E1
A
A1
L
R
c
A2
β
B1
p
eB
B
INCHES*
NOM
0.300
8
MILLIMETERS
Units
MAX
MIN
NOM
7.62
8
MAX
Dimension Limits
PCB Row Spacing
Number of Pins
MIN
n
Pitch
p
B
B1
R
c
0.100
0.018
0.060
0.005
0.012
0.150
0.080
0.020
0.130
0.370
0.250
0.280
0.342
10
2.54
0.56
Lower Lead Width
Upper Lead Width
Shoulder Radius
0.014
0.022
0.36
1.40
0.46
1.52
0.13
0.29
3.81
2.03
0.51
3.30
9.40
6.35
7.10
8.67
10
†
1.65
0.25
0.38
4.06
2.54
0.89
3.56
9.78
6.60
7.42
9.65
15
0.055
0.000
0.006
0.140
0.060
0.005
0.120
0.355
0.245
0.267
0.310
5
0.065
0.010
0.015
0.160
0.100
0.035
0.140
0.385
0.260
0.292
0.380
15
0.00
0.20
3.56
1.52
0.13
3.05
9.02
6.22
6.78
7.87
5
Lead Thickness
Top to Seating Plane
Top of Lead to Seating Plane
Base to Seating Plane
Tip to Seating Plane
Package Length
Molded Package Width
Radius to Radius Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
A
A1
A2
L
D
E
E1
eB
α
‡
‡
β
5
10
15
5
10
15
* Controlling Parameter.
†
Dimension “B1” does not include dam-bar protrusions. Dam-bar protrusions shall not exceed 0.003”
(0.076 mm) per side or 0.006” (0.152 mm) more than dimension “B1.”
‡
Dimensions “D” and “E” do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed 0.010” (0.254 mm) per side or 0.020” (0.508 mm) more than dimensions “D” or “E.”
DS40181B-page 104
Preliminary
1998 Microchip Technology Inc.
MICROCHIP [ MICROCHIP ]
