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W3H32M64EA-400SBM 参数 Datasheet PDF下载

W3H32M64EA-400SBM图片预览
型号: W3H32M64EA-400SBM
PDF下载: 下载PDF文件 查看货源
内容描述: [DDR DRAM, 32MX64, CMOS, PBGA208, 16 X 20 MM, 1 MM PITCH, PLASTIC, BGA-208]
分类和应用: 动态存储器双倍数据速率内存集成电路
文件页数/大小: 27 页 / 1197 K
品牌: MERCURY [ MERCURY UNITED ELECTRONICS INC ]
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W3H32M64EA-XSBX  
ADVANCED  
DESCRIPTION  
GENERAL NOTES  
The 2Gb DDR2 SDRAM is a high-speed CMOS, dynamic random-  
access memory containing 2,147,483,648 bits. Each of the four  
chips in the MCP are internally congured as 4-bank DRAM. The  
block diagram of the device is shown in Figure 2. Ball assignments  
and are shown in Figure 3.  
The functionality and the timing specications discussed in  
this data sheet are for the DLL-enabled mode of operation.  
Throughout the data sheet, the various gures and text  
refer to DQs as “DQ.” The DQ term is to be interpreted  
as any and all DQ collectively, unless specically stated  
otherwise. Additionally, each chip is divided into 2 bytes, the  
lower byte and upper byte. For the lower byte (DQ0–DQ7),  
DM refers to LDM and DQS refers to LDQS. For the upper  
byte (DQ8–DQ15), DM refers to UDM and DQS refers to  
UDQS.  
The 2Gb DDR2 SDRAM uses a double-data-rate architecture to  
achieve high-speed operation. The double data rate architecture is  
essentially a 4n-prefetch architecture, with an interface designed  
to transfer two data words per clock cycle at the I/O balls. A single  
read or write access for the 2Gb DDR2 SDRAM effectively consists  
of a single 4n-bit-wide, one-clock-cycle data transfer at the internal  
DRAM core and four corresponding n-bit-wide, one-half-clock-cycle  
data transfers at the I/O balls.  
Complete functionality is described throughout the  
document and any page or diagram may have been  
simplied to convey a topic and may not be inclusive of all  
requirements.  
A bidirectional data strobe (DQS, DQS#) is transmitted externally,  
along with data, for use in data capture at the receiver. DQS is a  
strobe transmitted by the DDR2 SDRAM during READs and by  
the memory controller during WRITEs. DQS is edge-aligned with  
data for READs and center-aligned with data for WRITEs. There  
are strobes, one for the lower byte (LDQS, LDQS#) and one for  
the upper byte (UDQS, UDQS#).  
Any specic requirement takes precedence over a general  
statement.  
INITIALIZATION  
DDR2 SDRAMs must be powered up and initialized in a  
predened manner. Operational procedures other than those  
specied may result in undened operation. The following  
sequence is required for power up and initialization and is  
shown in Figure 4 on page 7.  
The 2Gb DDR2 SDRAM operates from a differential clock (CK and  
CK#); the crossing of CK going HIGH and CK# going LOW will  
be referred to as the positive edge of CK. Commands (address  
and control signals) are registered at every positive edge of CK.  
Input data is registered on both edges of DQS, and output data is  
referenced to both edges of DQS, as well as to both edges of CK.  
1. Applying power; if CKE is maintained below 0.2 x  
V
CCQ, outputs remain disabled. To guarantee RTT (ODT  
resistance) is off, VREF must be valid and a low level  
must be applied to the ODT ball (all other inputs may be  
undened, I/Os and outputs must be less than VCCQ during  
voltage ramp time to avoid DDR2 SDRAM device latch-up).  
At least one of the following two sets of conditions (A or B)  
must be met to obtain a stable supply state (stable supply  
dened as VCC, VCCQ, VREF, and VTT are between their  
minimum and maximum values as stated in Table 5):  
Read and write accesses to the DDR2 SDRAM are burst oriented;  
accesses start at a selected location and continue for a programmed  
number of locations in a programmed sequence. Accesses begin  
with the registration of anACTIVE command, which is then followed  
by a READ or WRITE command. The address bits registered  
coincident with the ACTIVE command are used to select the bank  
and row to be accessed. The address bits registered coincident  
with the READ or WRITE command are used to select the bank  
and the starting column location for the burst access.  
A. (single power source) The VCC voltage ramp from  
300mV to VCC (MIN) must take no longer than 200ms;  
during the VCC voltage ramp, |VCC - VCCQ| 0.3V. Once  
supply voltage ramping is complete (when VCCQ crosses  
The DDR2 SDRAM provides for programmable read or write  
burst lengths of four or eight locations. DDR2 SDRAM supports  
interrupting a burst read of eight with another read, or a burst  
write of eight with another write. An auto precharge function may  
be enabled to provide a self-timed row precharge that is initiated  
at the end of the burst access.  
V
CC (MIN)), Table20 specications apply.  
CC, VCCQ are driven from a single power converter  
output  
V
V
TT is limited to 0.95V MAX  
As with standard DDR SDRAMs, the pipelined, multibank  
architecture of DDR2 SDRAMs allows for concurrent operation,  
thereby providing high, effective bandwidth by hiding row precharge  
and activation time.  
VREF tracks VCCQ/2; VREF must be within ±0.3V with  
respect to VCCQ/2 during supply ramp time  
VCCQ VREF at all times  
Aself refresh mode is provided, along with a power-saving power-  
down mode.  
B. (multiple power sources) VCC VCCQ must be  
maintained during supply voltage ramping, for both AC  
and DC levels, until supply voltage ramping completes  
(VCCQ crosses VCC [MIN]). Once supply voltage ramping  
is complete, Table 5 specications apply.  
All inputs are compatible with the JEDEC standard for SSTL_18.  
All full drive-strength outputs are SSTL_18-compatible.  
Apply VCC before or at the same time as VCCQ; VCC  
voltage ramp time must be 200ms from when  
V
CC ramps from 300mV to VCC (MIN)  
Microsemi Corporation reserves the right to change products or specications without notice.  
August 2011 © 2011 Microsemi Corporation. All rights reserved.  
Rev.1  
5
Microsemi Corporation • (602) 437-1520 • www.microsemi.com