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MX25L12845EMI-10G 参数 Datasheet PDF下载

MX25L12845EMI-10G图片预览
型号: MX25L12845EMI-10G
PDF下载: 下载PDF文件 查看货源
内容描述: 128M - BIT [ ×1 / ×2 / ×4 ] CMOS MXSMIO (串行多I / O )Flash存储器 [128M-BIT [x 1/x 2/x 4] CMOS MXSMIO (SERIAL MULTI I/O) FLASH MEMORY]
分类和应用: 存储
文件页数/大小: 69 页 / 3278 K
品牌: Macronix [ MACRONIX INTERNATIONAL ]
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MX25L12845E  
(21) Deep Power-down (DP)  
The Deep Power-down (DP) instruction is for setting the device on the minimizing the power consumption (to enter-  
ing the Deep Power-down mode), the standby current is reduced from ISB1 to ISB2). The Deep Power-down mode  
requires the Deep Power-down (DP) instruction to enter, during the Deep Power-down mode, the device is not ac-  
tive and all Write/Program/Erase instruction are ignored. When CS# goes high, it's only in standby mode not deep  
power-down mode. It's different from Standby mode.  
The sequence of issuing DP instruction is: CS# goes low→ sending DP instruction code→ CS# goes high. (see Fig-  
ure 32)  
Once the DP instruction is set, all instruction will be ignored except the Release from Deep Power-down mode (RDP)  
and Read Electronic Signature (RES) instruction. (those instructions allow the ID being reading out). When Power-  
down, the deep power-down mode automatically stops, and when power-up, the device automatically is in standby  
mode. For RDP instruction the CS# must go high exactly at the byte boundary (the latest eighth bit of instruction  
code been latched-in); otherwise, the instruction will not executed. As soon as Chip Select (CS#) goes high, a delay  
of tDP is required before entering the Deep Power-down mode and reducing the current to ISB2.  
(22) Release from Deep Power-down (RDP), Read Electronic Signature (RES)  
The Release from Deep Power-down (RDP) instruction is terminated by driving Chip Select (CS#) High. When Chip  
Select (CS#) is driven High, the device is put in the standby Power mode. If the device was not previously in the  
Deep Power-down mode, the transition to the standby Power mode is immediate. If the device was previously in the  
Deep Power-down mode, though, the transition to the standby Power mode is delayed by tRES2, and Chip Select (CS#)  
must remain High for at least tRES2(max), as specified in Table 10. Once in the standby mode, the device waits to  
be selected, so that it can receive, decode and execute instructions.  
RES instruction is for reading out the old style of 8-bit Electronic Signature, whose values are shown as table of ID  
Definitions. This is not the same as RDID instruction. It is not recommended to use for new design. For new design,  
please use RDID instruction. Even in Deep power-down mode, the RDP and RES are also allowed to be executed,  
only except the device is in progress of program/erase/write cycles; there's no effect on the current program/erase/  
write cycles in progress. The sequence is shown as Figure 33,34.  
The RES instruction is ended by CS# goes high after the ID been read out at least once. The ID outputs repeat-  
edly if continuously send the additional clock cycles on SCLK while CS# is at low. If the device was not previously  
in Deep Power-down mode, the device transition to standby mode is immediate. If the device was previously in  
Deep Power-down mode, there's a delay of tRES2 to transit to standby mode, and CS# must remain to high at least  
tRES2(max). Once in the standby mode, the device waits to be selected, so it can be receive, decode, and execute  
instruction.  
The RDP instruction is for releasing from Deep Power-down Mode.  
(23) Read Electronic Manufacturer ID & Device ID (REMS), (REMS2), (REMS4), (REMS4D)  
The REMS, REMS2, REMS4 and REMS4D instruction provides both the JEDEC assigned Manufacturer ID and the  
specific Device ID.  
The instruction is initiated by driving the CS# pin low and shift the instruction code "90h", "CFh", "DFh" or "EFh" fol-  
lowed by two dummy bytes and one bytes address (A7~A0). After which, the Manufacturer ID for MXIC (C2h) and  
the Device ID are shifted out on the falling edge of SCLK with most significant bit (MSB) first as shown in Figure  
35. The Device ID values are listed in table of ID Definitions. If the one-byte address is initially set to 01h, then the  
Device ID will be read first and then followed by the Manufacturer ID. The Manufacturer and Device IDs can be read  
continuously, alternating from one to the other. The instruction is completed by driving CS# high.  
P/N: PM1428  
REV. 0.06, MAR. 05, 2009  
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