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MAX8969 参数 Datasheet PDF下载

MAX8969图片预览
型号: MAX8969
PDF下载: 下载PDF文件 查看货源
内容描述: 升压转换器为手持式应用 [Step-Up Converter for Handheld Applications]
分类和应用: 转换器升压转换器
文件页数/大小: 18 页 / 1996 K
品牌: MAXIM [ MAXIM INTEGRATED PRODUCTS ]
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Step-Up Converter  
for Handheld Applications  
ABSOLUTE MAXIMUM RATINGS  
IN, OUT_ to GND_................................................-0.3V to +6.0V  
Operating Temperature Range.......................... -40NC to +85NC  
EN, TREN to GND_ ............ -0.3V to lower of (V + 0.3V) or 6V  
Junction Temperature .....................................................+150NC  
Storage Temperature Range............................ -65NC to +150NC  
Soldering Temperature (reflow) (Note 1) ........................+260NC  
IN  
Total LX_ Current...........................................................3.2A  
RMS  
OUT_ Short Circuit to GND_ .....................................Continuous  
Continuous Power Dissipation (T = +70NC)  
A
WLP (derate 12mW/NC above +70NC).........................960mW  
Note 1: This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile that the  
device can be exposed to during board level solder attach and rework. This limit permits only the use of the solder pro-  
files recommended in the industry-standard specification JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and Convection  
reflow. Preheating is required. Hand or wave soldering is not allowed.  
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional  
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute  
maximum rating conditions for extended periods may affect device reliability.  
PACKAGE THERMAL CHARACTERISTICS (Note 2)  
WLP  
Junction-to-Ambient Thermal Resistance (B ) ..........83NC/W  
JA  
Junction-to-Case Thermal Resistance (B )...............50NC/W  
JC  
Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-  
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.  
ELECTRICAL CHARACTERISTICS  
(V = 2.6V, T = -40NC to +85NC, unless otherwise noted. Typical values are T = +25NC.) (Note 3)  
IN  
A
A
PARAMETER  
CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
Operating Input Voltage Range  
Minimum Startup Voltage  
2.5  
5.5  
V
V
2.3  
2.2  
Undervoltage Lockout Threshold (UVLO)  
V
falling, 75mV hysteresis  
2.1  
2.3  
5
V
IN  
T
T
= +25NC  
0.8  
1
V
V
= V  
= V = 0V,  
OUT  
A
A
EN  
TREN  
Shutdown Supply Current  
FA  
NC  
= 4.8V  
IN  
= +85NC  
Thermal Shutdown  
BOOST MODE  
T
rising, 20NC hysteresis  
+165  
A
Peak Output Current  
V
> 2.5V (Note 4)  
1
A
IN  
V
OUT  
V
OUT  
V
OUT  
V
OUT  
V
OUT  
V
OUT  
= 3.3V  
= 3.5V  
= 3.7V  
= 4.25V  
= 4.7V  
= 5.0V  
0.9  
0.8  
0.7  
0.7  
0.7  
0.7  
V
load  
> 2.5V, pulse  
IN  
Continuous Output Current  
A
Switching Frequency  
(Note 4)  
3
MHz  
V
No load, V  
No load, V  
No load, V  
No load, V  
No load, V  
_
= 3.3V  
= 3.5V  
= 3.7V  
3.175  
3.40  
3.64  
4.10  
4.85  
3.30  
3.50  
3.75  
4.25  
5.00  
3.40  
3.60  
3.85  
4.35  
5.10  
OUT TARGET  
_
OUT TARGET  
_
Output Voltage Accuracy  
OUT TARGET  
_
= 4.25V  
= 5V  
OUT TARGET  
_
OUT TARGET  
2
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