±±15k EꢀDꢁ-rotected, ±µA, ±6Mbps, Dual/Quad
Lowꢁkoltage Level Translators in UCꢀ-
IEC 1000-4-2
The IEC 1000-4-2 standard covers ESD testing and
performance of finished equipment; it does not specifi-
cally refer to integrated circuits. The MAX3372E–
MAX3379E and MAX3390E–MAX3393E help to design
equipment that meets Level 3 of IEC 1000-4-2, without
the need for additional ESD-protection components.
±±15k EꢀD -rotection
As with all Maxim devices, ESD-protection structures are
incorporated on all pins to protect against electrostatic
discharges encountered during handling and assembly.
The I/O V
lines have extra protection against static
CC
electricity. Maxim’s engineers have developed state-of-
the-art structures to protect these pins against ESD of
15kV without damage. The ESD structures withstand
high ESD in all states: normal operation, three-state out-
put mode, and powered down. After an ESD event,
Maxim’s E versions keep working without latchup,
whereas competing products can latch and must be
powered down to remove latchup.
The major difference between tests done using the
Human Body Model and IEC 1000-4-2 is higher peak cur-
rent in IEC 1000-4-2, because series resistance is lower
in the IEC 1000-4-2 model. Hence, the ESD withstand
voltage measured to IEC 1000-4-2 is generally lower than
that measured using the Human Body Model. Figure 4a
shows the IEC 1000-4-2 model, and Figure 4b shows the
current waveform for the 8kV, IEC 1000-4-2, Level 4,
ESD contact-discharge test.
ESD protection can be tested in various ways. The I/O
V
lines of this product family are characterized for
CC
protection to the following limits:
The air-gap test involves approaching the device with a
charged probe. The contact-discharge method connects
the probe to the device before the probe is energized.
1) 15kV using the Human Body Model
2) 8kV using the Contact Discharge method specified
in IEC 1000-4-2
3) 10kV using IEC 1000-4-2’s Air-Gap Discharge
Machine Model
The Machine Model for ESD tests all pins using a
200pF storage capacitor and zero discharge resis-
tance. Its objective is to emulate the stress caused by
contact that occurs with handling and assembly during
manufacturing. Of course, all pins require this protec-
tion during manufacturing, not just inputs and outputs.
Therefore, after PC board assembly, the Machine
Model is less relevant to I/O ports.
method
ESD Test Conditions
ESD performance depends on a variety of conditions.
Contact Maxim for a reliability report that documents
test setup, test methodology, and test results.
Human Body Model
Figure 3a shows the Human Body Model and Figure 3b
shows the current waveform it generates when dis-
charged into a low impedance. This model consists of
a 100pF capacitor charged to the ESD voltage of inter-
est, which is then discharged into the test device
through a 1.5kΩ resistor.
R
1MΩ
R 1500Ω
D
C
I 100%
P
90%
PEAK-TO-PEAK RINGING
(NOT DRAWN TO SCALE)
I
r
DISCHARGE
RESISTANCE
CHARGE-CURRENT-
LIMIT RESISTOR
AMPERES
HIGH-
VOLTAGE
DC
DEVICE
UNDER
TEST
C
s
100pF
STORAGE
CAPACITOR
36.8%
SOURCE
10%
0
TIME
0
t
RL
t
DL
CURRENT WAVEFORM
Figure 3a. Human Body ESD Test Model
Figure 3b. Human Body Current Waveform
______________________________________________________________________________________ 13
MAXIM [ MAXIM INTEGRATED PRODUCTS ]
