LTC3642
PACKAGE DESCRIPTION
MS8E Package
8-Lead Plastic MSOP, Exposed Die Pad
(Reference LTC DWG # 05-08-1662 Rev D)
BOTTOM VIEW OF
EXPOSED PAD OPTION
2.06 0.102
(.081 .004)
1
1.83 0.102
(.072 .004)
0.889 0.127
(.035 .005)
2.794 0.102
(.110 .004)
5.23
(.206)
MIN
3.20 – 3.45
(.126 – .136)
2.083 0.102
(.082 .004)
8
3.00 0.102
(.118 .004)
(NOTE 3)
0.52
(.0205)
REF
0.65
(.0256)
BSC
0.42 0.038
(.0165 .0015)
TYP
8
7 6 5
RECOMMENDED SOLDER PAD LAYOUT
3.00 0.102
(.118 .004)
(NOTE 4)
4.90 0.152
(.193 .006)
DETAIL “A”
0° – 6° TYP
0.254
(.010)
GAUGE PLANE
1
2
3
4
0.53 0.152
(.021 .006)
1.10
(.043)
MAX
0.86
(.034)
REF
DETAIL “A”
0.18
(.007)
SEATING
PLANE
0.22 – 0.38
(.009 – .015)
TYP
0.1016 0.0508
(.004 .002)
0.65
(.0256)
BSC
MSOP (MS8E) 0307 REV D
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
3642f
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
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Linear [ Linear ]
