LTC3642
PACKAGE DESCRIPTION
DD Package
8-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1698)
0.675 p0.05
3.5 p0.05
2.15 p0.05 (2 SIDES)
1.65 p0.05
PACKAGE
OUTLINE
0.25 p 0.05
0.50
BSC
2.38 p0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
R = 0.115
0.38 p 0.10
TYP
5
8
3.00 p0.10
(4 SIDES)
1.65 p 0.10
(2 SIDES)
PIN 1
TOP MARK
(NOTE 6)
(DD) DFN 1203
4
1
0.25 p 0.05
0.75 p0.05
0.200 REF
0.50 BSC
2.38 p0.10
(2 SIDES)
0.00 – 0.05
BOTTOM VIEW—EXPOSED PAD
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON TOP AND BOTTOM OF PACKAGE
3642f
18
Linear [ Linear ]
