LT6003/LT6004/LT6005
PACKAGE DESCRIPTION
DHC Package
16-Lead Plastic DFN (5mm × 3mm)
(Reference LTC DWG # 05-08-1706)
R = 0.115
TYP
0.40 0.10
5.00 0.10
(2 SIDES)
9
16
R = 0.20
TYP
0.65 0.05
3.00 0.10
(2 SIDES)
3.50 0.05
1.65 0.05
(2 SIDES)
1.65 0.10
(2 SIDES)
PACKAGE
OUTLINE
2.20 0.05
PIN 1
PIN 1
NOTCH
TOP MARK
(SEE NOTE 6)
(DHC16) DFN 1103
8
1
0.25 0.05
0.50 BSC
0.75 0.05
0.200 REF
0.25 0.05
0.50 BSC
4.40 0.10
(2 SIDES)
4.40 0.05
(2 SIDES)
0.00 – 0.05
BOTTOM VIEW—EXPOSED PAD
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
NOTE:
1. DRAWING PROPOSED TO BE MADE VARIATION OF VERSION (WJED-1) IN JEDEC
PACKAGE OUTLINE MO-229
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
GN Package
16-Lead Plastic SSOP (Narrow .150 Inch)
(Reference LTC DWG # 05-08-1641)
.189 – .196*
(4.801 – 4.978)
.009
(0.229)
REF
.015 .004
(0.38 0.10)
.045 .005
16 15 14 13 12 11 10 9
× 45°
.0532 – .0688
(1.35 – 1.75)
.004 – .0098
(0.102 – 0.249)
0° – 8°
.007 – .0098
(0.178 – 0.249)
TYP
.229 – .244
(5.817 – 6.198)
.150 – .157**
(3.810 – 3.988)
.016 – .050
(0.406 – 1.270)
.0250
(0.635)
BSC
.008 – .012
.254 MIN
.150 – .165
(0.203 – 0.305)
TYP
NOTE:
1. CONTROLLING DIMENSION: INCHES
3. DRAWING NOT TO SCALE
INCHES
2. DIMENSIONS ARE IN
(MILLIMETERS)
*DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE
**DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD
FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE
1
2
3
4
5
6
7
8
.0165 .0015
.0250 BSC
RECOMMENDED SOLDER PAD LAYOUT
GN16 (SSOP) 0204
600345fd
18
LINEAR_DIMENSIONS [ Linear Dimensions ]
