LT6003/LT6004/LT6005
PACKAGE DESCRIPTION
DD Package
8-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1698)
R = 0.115
0.38 ± 0.10
TYP
5
8
0.675 ±0.05
3.5 ±0.05
2.15 ±0.05 (2 SIDES)
1.65 ±0.05
3.00 ±0.10
(4 SIDES)
1.65 ± 0.10
(2 SIDES)
PIN 1
TOP MARK
(NOTE 6)
PACKAGE
OUTLINE
(DD) DFN 1203
4
1
0.25 ± 0.05
0.25 ± 0.05
0.75 ±0.05
0.200 REF
0.50 BSC
0.50
BSC
2.38 ±0.05
(2 SIDES)
2.38 ±0.10
(2 SIDES)
0.00 – 0.05
BOTTOM VIEW—EXPOSED PAD
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)
2. DRAWING NOT TO SCALE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON TOP AND BOTTOM OF PACKAGE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
MS8 Package
8-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1660 Rev F)
3.00 ± 0.102
(.118 ± .004)
(NOTE 3)
0.52
(.0205)
REF
8
7 6
5
0.889 ± 0.127
(.035 ± .005)
DETAIL “A”
0° – 6° TYP
3.00 ± 0.102
(.118 ± .004)
(NOTE 4)
0.254
(.010)
4.90 ± 0.152
(.193 ± .006)
5.23
(.206)
MIN
3.20 – 3.45
(.126 – .136)
GAUGE PLANE
0.53 ± 0.152
(.021 ± .006)
1
2
3
4
0.65
(.0256)
BSC
0.42 ± 0.038
1.10
(.043)
MAX
0.86
(.034)
REF
(.0165 ± .0015)
TYP
DETAIL “A”
RECOMMENDED SOLDER PAD LAYOUT
0.18
(.007)
SEATING
PLANE
0.22 – 0.38
0.1016 ± 0.0508
(.009 – .015)
(.004 ± .002)
0.65
(.0256)
BSC
TYP
MSOP (MS8) 0307 REV F
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
600345fd
17
LINEAR_DIMENSIONS [ Linear Dimensions ]
