LT6003/LT6004/LT6005
PACKAGE DESCRIPTION
DC Package
4-Lead Plastic DFN (2mm × 2mm)
(Reference LTC DWG # 05-08-1724 Rev B)
1.35 ±0.05
1.00 ±0.05
1.30 ±0.05
2.00 ±0.05
PACKAGE
OUTLINE
0.25 ± 0.05
0.45 BSC
1.35 REF
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDEDED
R = 0.05
TYP
R = 0.115
TYP
1.35 ± 0.10
1.00 ±0.10
2.00 ±0.10
PIN 1 NOTCH
R = 0.20 OR
0.25 × 45°
CHAMFER
(4 SIDES)
PIN 1 BAR
TOP MARK
(SEE NOTE 6)
4
1
0.40 ±0.10
0.70 ±0.05
0.23 ± 0.05
0.45 BSC
0.75 ±0.05
0.200 REF
1.35 REF
BOTTOM VIEW—EXPOSED PAD
(DC4) DFN 0309 REV
B
0.00 – 0.05
NOTE:
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1
LOCATION ON THE TOP AND BOTTOM OF PACKAGE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
S5 Package
5-Lead Plastic TSOT-23
(Reference LTC DWG # 05-08-1635)
0.62
MAX
0.95
REF
2.90 BSC
(NOTE 4)
1.22 REF
1.50 – 1.75
(NOTE 4)
2.80 BSC
1.4 MIN
3.85 MAX 2.62 REF
PIN ONE
RECOMMENDED SOLDER PAD LAYOUT
PER IPC CALCULATOR
0.30 – 0.45 TYP
5 PLCS (NOTE 3)
0.95 BSC
0.80 – 0.90
0.20 BSC
DATUM ‘A’
0.01 – 0.10
1.00 MAX
0.30 – 0.50 REF
1.90 BSC
0.09 – 0.20
(NOTE 3)
S5 TSOT-23 0302 REV B
NOTE:
1. DIMENSIONS ARE IN MILLIMETERS
2. DRAWING NOT TO SCALE
3. DIMENSIONS ARE INCLUSIVE OF PLATING
4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR
5. MOLD FLASH SHALL NOT EXCEED 0.254mm
6. JEDEC PACKAGE REFERENCE IS MO-193
600345fd
16
LINEAR_DIMENSIONS [ Linear Dimensions ]
