TYPICAL THERMAL CHARACTERISTICS
PALCE22V10
Measured at 25°C ambient. These parameters are not tested.
Typ
Parameter
Symbol
Parameter Description
Thermal impedance, junction to case
SKINNY DIP
PLCC
18
Unit
θ
θ
20
73
66
61
55
52
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
jc
ja
Thermal impedance, junction to ambient
55
200 lfpm air
400 lfpm air
600 lfpm air
800 lfpm air
48
43
θ
Thermal impedance, junction to ambient with air flow
jma
40
37
Plastic θjc Considerations
The data listed for plastic θjc are for reference only and are not recommended for use in calculating junction temperatures. The
heat-flow paths in plastic-encapsulated devices are complex, making the θjc measurement relative to a specific location on the pack-
age surface. Tests indicate this measurement reference point is directly below the die-attach area on the bottom center of the package.
Furthermore, θjc tests on packages are performed in a constant-temperature bath, keeping the package surface at a constant tem-
perature. Therefore, the measurements can only be used in a similar environment.
32
PALCE22V10 and PALCE22V10Z Families
LATTICE [ LATTICE SEMICONDUCTOR ]
