X9C102, X9C103, X9C104, X9C503
Ordering Information
PART
NUMBER
PART
MARKING
RTOTAL
(kΩ)
TEMP RANGE
(°C)
PACKAGE
DWG. #
PACKAGE
8 Ld PDIP
X9C102P
X9C102P
X9C102P Z
1
0 to +70
0 to +70
MDP0031
X9C102PZ (Notes 1, 2)
X9C102PI
8 Ld PDIP (Pb-free)
8 Ld PDIP
MDP0031
MDP0031
MDP0031
MDP0027
MDP0027
MDP0027
MDP0027
MDP0031
MDP0031
MDP0031
MDP0031
MDP0027
MDP0027
MDP0027
MDP0027
MDP0031
MDP0031
MDP0031
MDP0031
MDP0027
MDP0027
MDP0027
MDP0027
MDP0031
MDP0031
MDP0031
MDP0027
MDP0027
MDP0027
MDP0027
X9C102P I
X9C102P ZI
X9C102S
-40 to +85
-40 to +85
0 to +70
X9C102PIZ (Notes 1, 2)
X9C102S*, **
8 Ld PDIP (Pb-free)
8 Ld SOIC
X9C102SZ* (Note 1)
X9C102SI*, **
X9C102S Z
X9C102S I
X9C102S ZI
X9C103P
0 to +70
8 Ld SOIC (Pb-free)
8 Ld SOIC
-40 to +85
-40 to +85
0 to +70
X9C102SIZ*, ** (Note 1)
X9C103P
8 Ld SOIC (Pb-free)
8 Ld PDIP
10
X9C103PZ (Notes 1, 2)
X9C103PI
X9C103P Z
X9C103P I
X9C103P ZI
X9C103S
0 to +70
8 Ld PDIP (Pb-free)
8 Ld PDIP
-40 to +85
-40 to +85
0 to +70
X9C103PIZ (Note 1)
X9C103S*, **
8 Ld PDIP (Pb-free)
8 Ld SOIC
X9C103SZ*, ** (Note 1)
X9C103SI*, **
X9C103S Z
X9C103S I
X9C103S ZI
X9C503P
0 to +70
8 Ld SOIC (Pb-free)
8 Ld SOIC
-40 to +85
-40 to +85
0 to +70
X9C103SIZ*, ** (Note 1)
X9C503P
8 Ld SOIC (Pb-free)
8 Ld PDIP
50
X9C503PZ (Notes 1, 2)
X9C503PI
X9C503P Z
X9C503P I
X9C503P ZI
X9C503S
0 to +70
8 Ld PDIP (Pb-free)
8 Ld PDIP
-40 to +85
-40 to +85
0 to +70
X9C503PIZ (Notes 1, 2)
X9C503S*
8 Ld PDIP (Pb-free)
8 Ld SOIC
X9C503SZ* (Note 1)
X9C503SI*, **
X9C503S Z
X9C503S I
X9C503S ZI
X9C104P
0 to +70
8 Ld SOIC (Pb-free)
8 Ld SOIC
-40 to +85
-40 to +85
0 to +70
X9C503SIZ*, ** (Note 1)
X9C104P
8 Ld SOIC (Pb-free)
8 Ld PDIP
100
X9C104PI
X9C104P I
X9C104P ZI
X9C104S
-40 to +85
-40 to +85
0 to +70
8 Ld PDIP
X9C104PIZ (Notes 1, 2)
X9C104S*, **
8 Ld PDIP (Pb-free)
8 Ld SOIC
X9C104SZ*, ** (Note 1)
X9C104SI*, **
X9C104S Z
X9C104S I
X9C104S ZI
0 to +70
8 Ld SOIC (Pb-free)
8 Ld SOIC
-40 to +85
-40 to +85
X9C104SIZ*, ** (Note 1)
8 Ld SOIC (Pb-free)
*Add “T1” suffix for tape and reel. Please refer to TB347 for details on reel specifications.
**Add “T2” suffix for tape and reel. Please refer to TB347 for details on reel specifications.
NOTES:
1. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100%
matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering
operations). Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free
requirements of IPC/JEDEC J STD-020.
2. Pb-free PDIPs can be used for through-hole wave solder processing only. They are not intended for use in Reflow solder processing applications.
FN8222.3
July 20, 2009
2
INTERSIL [ Intersil ]
