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HIP6016CB 参数 Datasheet PDF下载

HIP6016CB图片预览
型号: HIP6016CB
PDF下载: 下载PDF文件 查看货源
内容描述: 先进的PWM和力量线性双控制 [Advanced PWM and Dual Linear Power Control]
分类和应用: 开关光电二极管
文件页数/大小: 14 页 / 134 K
品牌: INTERSIL [ Intersil ]
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HIP6016  
Shutdown  
+5V  
IN  
The PWM output does not switch until the soft-start voltage  
+3.3V  
IN  
+12V  
(V ) exceeds the oscillator’s valley voltage. Additionally, the  
C
SS  
IN  
C
C
OCSET  
VCC  
VCC GND  
reference on each linear’s amplifier is clamped to the soft-  
start voltage. Holding the SS pin low with an open drain or  
collector signal turns off all three regulators.  
V
R
OCSET  
IN2  
OCSET  
Q1  
Q2  
Q3  
UGATE  
L
V
OUT1  
OUT3  
GATE3  
V
OUT1  
The ‘11111’ VID code resulting in an INHIBIT, as shown in  
Table 1, also shuts down the IC.  
PHASE  
HIP6016  
C
OUT1  
Layout Considerations  
LGATE  
PGND  
CR1  
V
OUT2  
SS  
MOSFETs switch very fast and efficiently. The speed with  
which the current transitions from one device to another  
causes voltage spikes across the interconnecting impedances  
and parasitic circuit elements. The voltage spikes can  
degrade efficiency, radiate noise into the circuit, and lead to  
device over-voltage stress. Careful component layout and  
printed circuit design minimizes the voltage spikes in the  
converter. Consider, as an example, the turn-off transition of  
the upper PWM MOSFET. Prior to turn-off, the upper  
MOSFET was carrying the full load current. During the turn-  
off, current stops flowing in the upper MOSFET and is picked  
up by the lower MOSFET (and/or parallel Schottky diode).  
Any inductance in the switched current path generates a large  
voltage spike during the switching interval. Careful component  
selection, tight layout of the critical components, and short,  
wide circuit traces minimize the magnitude of voltage spikes.  
Contact Intersil for evaluation board drawings of the  
component placement and printed circuit board.  
C
SS  
V
OUT2  
C
OUT2  
KEY  
ISLAND ON POWER PLANE LAYER  
ISLAND ON CIRCUIT PLANE LAYER  
VIA CONNECTION TO GROUND PLANE  
FIGURE 10. PRINTED CIRCUIT BOARD POWER PLANES AND  
ISLANDS  
Use copper filled polygons on the top and bottom circuit  
layers for the phase nodes. Use the remaining printed circuit  
layers for small signal wiring. The wiring traces from the  
control IC to the MOSFET gate and source should be sized  
to carry 1A currents. The traces for OUT2 need only be sized  
for 0.2A. Locate C  
OUT2  
close to the HIP6016 IC.  
PWM Controller Feedback Compensation  
Both PWM controllers use voltage-mode control for output  
regulation. This section highlights the design consideration  
for a voltage-mode controller. Apply the methods and  
considerations to both PWM controllers.  
There are two sets of critical components in a DC-DC  
converter using a HIP6016 controller. The power  
components are the most critical because they switch large  
amounts of energy. The critical small signal components  
connect to sensitive nodes or supply critical bypassing  
current.  
Figure 11 highlights the voltage-mode control loop for a  
synchronous-rectified buck converter. The output voltage is  
regulated to the reference voltage level. The reference  
voltage level is the DAC output voltage for the PWM  
controller. The error amplifier output (V ) is compared with  
the oscillator (OSC) triangular wave to provide a pulse-width  
The power components should be placed first. Locate the  
input capacitors close to the power switches. Minimize the  
length of the connections between the input capacitors and  
the power switches. Locate the output inductor and output  
capacitors between the MOSFETs and the load. Locate the  
PWM controller close to the MOSFETs.  
E/A  
modulated wave with an amplitude of V at the PHASE  
node. The PWM wave is smoothed by the output filter (L  
IN  
O
and C ).  
O
The critical small signal components include the bypass  
The modulator transfer function is the small-signal transfer  
function of V /V . This function is dominated by a DC  
capacitor for VCC and the soft-start capacitor, C . Locate  
SS  
OUT E/A  
gain and the output filter, with a double pole break frequency  
at F and a zero at F . The DC gain of the modulator is  
these components close to their connecting pins on the  
control IC. Minimize any leakage current paths from SS node  
because the internal current source is only 11µA.  
LC ESR  
simply the input voltage, V , divided by the peak-to-peak  
IN  
A multi-layer printed circuit board is recommended. Figure  
10 shows the connections of the critical components in the  
oscillator voltage, V  
OSC  
.
Modulator Break Frequency Equations  
converter. Note that capacitors C and C  
could each  
IN OUT  
represent numerous physical capacitors. Dedicate one solid  
layer for a ground plane and make all critical component  
ground connections with vias to this layer. Dedicate another  
solid layer as a power plane and break this plane into  
smaller islands of common voltage levels. The power plane  
should support the input power and output power nodes.  
1
1
= -----------------------------------------  
2π × ESR × C  
O
F
= ----------------------------------------  
F
LC  
2π ×  
L
× C  
ESR  
O
O
The compensation network consists of the error amplifier  
internal to the HIP6016 and the impedance networks Z  
IN  
and Z . The goal of the compensation network is to provide  
FB  
2-205