CD4029BMS
Timing Diagrams (Continued)
“RIPPLE CLOCKING”
UP/DOWN
PRESET
ENABLE
UP/D PE J1 J2 J3 J4
UP/D PE J1 J2 J3 J4
UP/D PE J1 J2 J3 J4
CI
CD4029
CO
CI
CD4029
CO
CI
CD4029
CO
B/D CL Q1 Q2 Q3 Q4
B/D CL Q1 Q2 Q3 Q4
B/D CL Q1 Q2 Q3 Q4
CLOCK
1/4 CD4071B
1/4 CD4071B
BINARY/
DECADE
RIPPLE CLOCKING MODE:
THE UP/DOWN CONTROL CAN BE CHANGED AT ANY COUNT. THE ONLY
RESTRICTION ON CHANGING THE UP/DOWN CONTROL IS THAT THE CLOCK
INPUT TO THE FIRST COUNTING STAGE MUST BE HIGH. FOR CASCADING
COUNTERS OPERATING IN A FIXED UP-COUNT OR DOWN-COUNT MODE,
THE OR GATES ARE NOT REQUIRED BETWEEN STAGES, AND CO IS CON-
NECTED DIRECTLY TO THE CL INPUT OF THE NEXT STAGE WITH CI
GROUNDED.
FIGURE 13. CASCADING COUNTER PACKAGES (Continued)
Chip Dimensions and Pad Layout
Dimensions in parentheses are in millimeters
and are derived from the basic inch dimensions
as indicated. Grid graduations are in mils (10-3 inch)
METALLIZATION: Thickness: 11kÅ − 14kÅ, AL.
PASSIVATION: 10.4kÅ - 15.6kÅ, Silane
BOND PADS: 0.004 inches X 0.004 inches MIN
DIE THICKNESS: 0.0198 inches - 0.0218 inches
7-808
INTERSIL [ Intersil ]
