CD4027BMS
Typical Performance Characteristics (Continued)
AMBIENT TEMPERATURE (TA) = +25oC
AMBIENT TEMPERATURE (TA) = +25oC
trl tf = 5ns
CL = 50pF
250
200
150
100
50
30
25
20
15
10
5
SUPPLY VOLTAGE (VDD) = 5V
10V
15V
0
20
40
60
80
100
0
5
10
15
20
LOAD CAPACITANCE (CL) (pF)
SUPPLY VOLTAGE (VDD) (V)
FIGURE 7. TYPICAL PROPAGATION DELAY TIME vs LOAD
CAPACITANCE (SET TO Q, OR RESET TO Q)
FIGURE 8. TYPICAL MAXIMUM CLOCK FREQUENCY vs
SUPPLY VOLTAGE (TOGGLE MODE)
Chip Dimensions and Pad Layout
Dimensions in parentheses are in millimeters
and are derived from the basic inch dimensions
as indicated. Grid graduations are in mils (10-3 inch)
METALLIZATION: Thickness: 11kÅ − 14kÅ, AL.
PASSIVATION: 10.4kÅ - 15.6kÅ, Silane
BOND PADS: 0.004 inches X 0.004 inches MIN
DIE THICKNESS: 0.0198 inches - 0.0218 inches
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