28F640L30, 28F128L30, 28F256L30
2.3
Ballout Diagrams for Intel® Stacked Chip Scale Package
The 1.8 Volt Intel StrataFlash® wireless memory in Quad+ ballout device is available in an 88-ball
(80-active ball) Intel® Stacked Chip Scale Package for the 128-Mbit device and in an 88-ball (80-
active ball) Intel® Ultra-Thin Stacked Chip Scale Package for the 256-Mbit device. Figure 3 shows
the signal ballout. Refer to Section 5.0 for Mechanical Package Information.
Figure 3. 88-Ball (80-Active Ball) Stacked-CSP Package Ballout
1
2
3
4
5
6
7
8
DU
DU
DU
DU
A
B
C
A4
A5
A18
R-LB#
A17
A7
A19
A23
A24
A25
V SS
V SS
F1 -V CC F2-V CC
A2 1
A2 2
A9
A11
A12
A13
A15
S -CS 2
CLK
D
E
F
F-V PP ,
A3
R -W E# P1 -CS #
F-V PE N
A2
F-W P #
A DV #
A 20
A1 0
A1
A6
R-UB#
F-RS T#
F-WE #
A 8
D 13
D 14
D 6
A1 4
W A IT
D7
A16
G
A0
D8
D2
D10
D5
F2-CE #
F2-O E #
VCCQ
H
J
R-O E #
D0
D1
D3
D1 2
D4
S -CS 1# F1-O E #
F1-CE# P 2-CS #
D9
D11
D1 5
K
F3 -CE#
V CCQ
S-V CC
F1-V CC
P -VC C F2-V CC
V CCQ
P-Mode
L
V S S
DU
V S S
DU
V S S
V SS
VS S
DU
V S S
DU
M
T o p V ie w - B a ll Sid e D o w n
L e g e n d :
S R AM /P SR A M sp e cific
F la sh s p e cific
G lo b a l
Datasheet
11
INTEL [ INTEL ]
