LXT971A 3.3V Dual-Speed Fast Ethernet Transceiver
7.0
Package Specifications
Figure 43. PBGA Package Specification
64-Ball Plastic Ball Grid Array Package
•
Part Number - LXT971ABC Commercial Temperature Range (0ºC to +70ºC)
•
Part Number - LXT971ABE Extended Temperature Range (-40ºC to +85ºC)
0.20
A
2.00 REF.
6.30
0.70 REF.
0.80
2.00 REF.
OPTION:
PIN A1 IDENTIFIER
1.00 ± 0.10
INK OR LASER MARKING
7.00 ± 0.20
(4X)
7.00 ± 0.20
B
A
B
C
D
E
F
G
1.26 ± 0.10
0.70 ± 0.025
0.26 ± 0.04
0.28 ± 0.10
TOP VIEW
H
8
7
6
5
4
3
2
1
0.30
0.40 ± 0.15
0.15
C
C
B
A
2
BOTTOM VIEW
C
SEATING PLANE
SIDE VIEW
3
NOTES:
1. All dimensions and tolerances conform to ASME Y 14.5 M - 1994.
2. Dimension is measured at the maximum solder ball diameter, parallel to primary datum C.
3. Primary datum C and seating plane are defined by the spherical crowns of the solder balls.
4. Maximum mold to substrate offset shall be 0.127.
5. The surface finish of the package shall be EDM Charmille #18 - #21.
6. Unless otherwise specified tolerance: Decimal ± 0.05 Angular ±2°.
88
Datasheet
Document #: 249414
Revision #: 002
Rev. Date: August 7, 2002
INTEL [ INTEL CORPORATION ]
