Intel® IXP42X Product Line of Network Processors and IXC1100 Control Plane Processor
4.0
Package and Pinout Information
The Intel® IXP42X Product Line of Network Processors and IXC1100 Control Plane Processor
have a 492-ball, plastic ball grid array (PBGA) package for commercial-temperature applications
and a pin-for-pin, compatible 492-ball, plastic ball grid array with a drop-in heat spreader (H) for
extended-temperature applications.
4.1
Package Description
Figure 7.
492-Pin Lead PBGA Package
-A-
0.127
A
35.00 0.20
30.00 0.25
(1)
0.90
0.60
Pin #1
Corner
ø
26 24 22
25 23 21
20 18
19
16 14 12 10
15 13
8
6
4
2
3 1
17
11
9
7
5
2
C
-B-
ø 0.30
S
A
S
S
B
A
B
C
D
E
F
G
H
J
Pin 1 ID
K
L
M
35.00 0.20
22.00 REF
N
P
R
T
U
(2)
1.27
30.00 0.25
V
W
+
+
Y
AA
AB
AC
AD
AE
AF
+
+ +
1.63 REF
ø1.0
45º Chamfer
4 Places
1.27
1.63 REF
22.00 REF
3 Places
TOP VIEW
2.38 0.21
1.17 0.05
30º
0.15
0.20
C
-C-
0.61 0.06
3
0.60 0.10
Seating Plane
SIDE VIEW
B1268-03
1.
2.
3.
All measurements are in millimeters (mm).
The size of the land pad at the interposer side (1) is 0.81 mm.
The size of the solder resist at the interposer side (2) is 0.66 mm.
March 2005
50
Datasheet
Document Number: 252479, Revision: 005
INTEL [ INTEL ]
