Features
Table 1–3. MAX II Packages & User I/O Pins
100-Pin
Micro
FineLine
BGA
(1)
80
76
Device
100-Pin
FineLine
BGA
(1)
80
76
100-Pin
TQFP
80
76
144-Pin
TQFP
256-Pin
Micro
FineLine
BGA
(1)
160
212
256-Pin
FineLine
BGA
324-Pin
FineLine
BGA
EPM240
EPM570
EPM1270
EPM2210
Note to
Table 1–3:
(1)
116
116
160
212
204
272
Packages available on 3.3 V/2.5 V devices in lead-free versions only.
Table 1–4. MAX II TQFP, FineLine BGA, & Micro FineLine BGA Package Sizes
Micro
FineLine
BGA
0.5
36
6X6
Package
100-Pin
FineLine
BGA
1
121
11 X 11
100-Pin
TQFP
0.5
256
16 × 16
144-Pin
TQFP
0.5
484
22 × 22
256-Pin
Micro
FineLine
BGA
0.5
121
11 X 11
256-Pin
FineLine
BGA
1
289
17 × 17
324-Pin
FineLine
BGA
1
361
19 × 19
Pitch (mm)
Area (mm2)
Length x width
(mm x mm)
1–4
MAX II Device Handbook, Volume 1
Core Version a.b.c variable
Altera Corporation
August 2006
INTEL [ INTEL CORPORATION ]
