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EPM1270GF100I4N 参数 Datasheet PDF下载

EPM1270GF100I4N图片预览
型号: EPM1270GF100I4N
PDF下载: 下载PDF文件 查看货源
内容描述: [Flash PLD, PBGA100, 11 X 11 MM, 1 MM PITCH, LEAD FREE, FBGA-100]
分类和应用: 输入元件可编程逻辑
文件页数/大小: 98 页 / 1060 K
品牌: INTEL [ INTEL CORPORATION ]
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Chapter 2. MAX II
Architecture
MII51002-1.6
Functional
Description
MAX
®
II devices contain a two-dimensional row- and column-based
architecture to implement custom logic. Column and row interconnect
provide signal interconnects between the logic array blocks (LABs).
The logic array consists of LABs, with 10 logic elements (LEs) in each
LAB. An LE is a small unit of logic providing efficient implementation of
user logic functions. LABs are grouped into rows and columns across the
device. The MultiTrack™ interconnect provides fast granular timing
delays between LABs. The fast routing between LEs provides minimum
timing delay for added levels of logic versus globally routed interconnect
structures.
The MAX II device I/O pins are fed by an I/O element (IOE) located at
the ends of LAB rows and columns around the periphery of the device.
Each IOE contains a bidirectional I/O buffer with several advanced
features. I/O pins support Schmitt trigger inputs and various
single-ended standards, such as 66-MHz, 32-bit PCI and LVTTL.
MAX II devices provide a global clock network. The global clock network
consists of four global clock lines that drive throughout the entire device,
providing clocks for all resources within the device. The global clock lines
can also be used for control signals such as clear, preset, or output enable.
Figure 2–1
shows a functional block diagram of the MAX II device.
Altera Corporation
August 2006
Core Version a.b.c variable
2–1
Preliminary