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EPM1270GF100I4N 参数 Datasheet PDF下载

EPM1270GF100I4N图片预览
型号: EPM1270GF100I4N
PDF下载: 下载PDF文件 查看货源
内容描述: [Flash PLD, PBGA100, 11 X 11 MM, 1 MM PITCH, LEAD FREE, FBGA-100]
分类和应用: 输入元件可编程逻辑
文件页数/大小: 98 页 / 1060 K
品牌: INTEL [ INTEL ]
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Chapter 2. MAX II  
Architecture  
MII51002-1.6  
MAX® II devices contain a two-dimensional row- and column-based  
architecture to implement custom logic. Column and row interconnect  
provide signal interconnects between the logic array blocks (LABs).  
Functional  
Description  
The logic array consists of LABs, with 10 logic elements (LEs) in each  
LAB. An LE is a small unit of logic providing efficient implementation of  
user logic functions. LABs are grouped into rows and columns across the  
device. The MultiTrack™ interconnect provides fast granular timing  
delays between LABs. The fast routing between LEs provides minimum  
timing delay for added levels of logic versus globally routed interconnect  
structures.  
The MAX II device I/O pins are fed by an I/O element (IOE) located at  
the ends of LAB rows and columns around the periphery of the device.  
Each IOE contains a bidirectional I/O buffer with several advanced  
features. I/O pins support Schmitt trigger inputs and various  
single-ended standards, such as 66-MHz, 32-bit PCI and LVTTL.  
MAX II devices provide a global clock network. The global clock network  
consists of four global clock lines that drive throughout the entire device,  
providing clocks for all resources within the device. The global clock lines  
can also be used for control signals such as clear, preset, or output enable.  
Figure 2–1 shows a functional block diagram of the MAX II device.  
Altera Corporation  
August 2006  
Core Version a.b.c variable  
2–1  
Preliminary  
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