Electrical Specifications
11.These parameters are based on design characterization and are not tested.
12.VTT must be provided via a separate voltage source and must not be connected to VCC
13.These specifications are measured at the package pin.
.
14.Baseboard bandwidth is limited to 20 MHz.
15.This specification refers to a single processor with RTT enabled.
16.This specification refers to a single processor with RTT disabled.
17.The voltage specification requirements are measured across the VCC_CACHE_SENSE and VSS_CACHE_SENSE pins at the socket
with a 100 MHz bandwidth oscilloscope, 1.5 pF maximum probe capacitance, and 1 MΩ minimum impedance. The maximum
length of ground wire on the probe should be less than 5 mm. Ensure external noise from the system is not coupled into the
scope probe.
18.This specification represents the VCC reduction due to each VID transition. See Section 2.2.
19.This specification refers to the total reduction of the load line due to VID transitions below the specified VID.
20.ICC_TDC is the sustained (DC equivalent) current that the processor is capable of drawing indefinitely and should be used for the
voltage regulator temperature assessment. The voltage regulator is responsible for monitoring its temperature and asserting the
necessary signal to inform the processor of a thermal excursion. The processor is capable of drawing ICC_TDC indefinitely. Refer
to Figure 2-3 for further details on the average processor current draw over various time durations. This parameter is based on
design characterization and is not tested.
21.ITT may draw up to 5A prior to power good assertion.
Figure 2-3. Processor Load Current vs. Time
155
150
145
140
135
130
125
0.01
0.1
1
10
100
1000
Time Duration (s)
NOTES:
1. Processor or voltage regulator thermal protection circuitry should not trip for load currents greater than
ICC_TDC
2. Not 100% tested. Specified by design characterization.
.
30
64-bit Intel® Xeon™ Processor MP with up to 8MB L3 Cache Datasheet
INTEL [ INTEL ]
