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MOBILE PENTIUM PROCESSOR WITH MMX™ TECHNOLOGY
4.4.2.
SIGNAL QUALITY SPECIFICATIONS
VSS) relative to VCC3 (or VSS) level after the signal
has reached its maximum voltage level. The input
diodes are assumed present.
Signals driven by the system into the mobile
Pentium processor with MMX technology on 0.25
Micron must meet signal quality specifications to
guarantee that the components read data properly
and to ensure that incoming signals do not affect
the reliability of the component. There are two
signal quality parameters: Ringback and Settling
Time. See Section 4.4.2.3 for CLK signal quality
specification.
Maximum Ringback on Inputs = 0.5V ( falling edge)
Maximum Ringback on Inputs = 0.7V (rising edge )
(with diodes)
If simulated without the input diodes, follow the
Maximum Overshoot/Undershoot specification. By
meeting the overshoot/undershoot specification, the
signal is guaranteed not to ringback excessively.
4.4.2.1.
Ringback
Excessive ringback can contribute to long-term
reliability degradation of the processor, and can
cause false signal detection. Ringback is simulated
at the input pin of a component using the input
buffer model. Ringback can be simulated with or
without the diodes that are in the input buffer model.
If simulated with the diodes present in the input
model, follow the maximum ringback specification.
Overshoot (Undershoot) is the absolute value of the
maximum voltage above VCC3 (below VSS). The
guideline assumes the absence of diodes on the
input.
Ringback is the absolute value of the maximum
voltage at the receiving pin below VCC3 (or above
·
Figure 12. Overshoot/Undershoot and Ringback Guidelines
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INTEL [ INTEL ]
