2. MAX V Architecture
MV51002-1.0
This chapter describes the architecture of the MAX
®
V device and contains the
following sections:
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Functional Description
MAX V devices contain a two-dimensional row- and column-based architecture to
implement custom logic. Row and column interconnects provide signal interconnects
between the logic array blocks (LABs).
Each LAB in the logic array contains 10 logic elements (LEs). An LE is a small unit of
logic that provides efficient implementation of user logic functions. LABs are grouped
into rows and columns across the device. The MultiTrack interconnect provides fast
granular timing delays between LABs. The fast routing between LEs provides
minimum timing delay for added levels of logic versus globally routed interconnect
structures.
The I/O elements (IOEs) located after the LAB rows and columns around the
periphery of the MAX V device feeds the I/O pins. Each IOE contains a bidirectional
I/O buffer with several advanced features. I/O pins support Schmitt trigger inputs
and various single-ended standards, such as 33-MHz, 32-bit PCI™, and LVTTL.
MAX V devices provide a global clock network. The global clock network consists of
four global clock lines that drive throughout the entire device, providing clocks for all
resources within the device. You can also use the global clock lines for control signals
such as clear, preset, or output enable.
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December 2010
INTEL [ INTEL CORPORATION ]
