Contents
1
Introduction..............................................................................................................9
1.1
1.2
1.3
1.4
Terminology .......................................................................................................9
References ....................................................................................................... 11
State of Data.................................................................................................... 11
Statement of Volatility ....................................................................................... 11
2
Electrical Specifications........................................................................................... 13
2.1
2.2
2.3
2.4
2.5
Processor Maximum Ratings ............................................................................... 13
Socket Voltage Identification............................................................................... 14
Signal Groups................................................................................................... 19
Processor DC Specifications ................................................................................ 21
Intel® QPI and Intel® Scalable Memory Interconnect (Intel® SMI)
Interface Differential Signaling............................................................................ 26
2.5.1 Intel QPI Signaling Specifications ............................................................. 27
2.5.2 Intel QPI Electrical Specifications.............................................................. 30
2.5.3 Intel SMI Signaling Specifications ............................................................. 34
2.5.4 Intel SMI Transmitter and Receiver Specifications....................................... 34
Platform Environmental Control Interface (PECI) DC Specifications........................... 40
2.6.1 DC Characteristics.................................................................................. 41
2.6.2 Input Device Hysteresis .......................................................................... 41
DC Specifications .............................................................................................. 42
AC Specifications............................................................................................... 43
Processor AC Timing Waveforms ......................................................................... 49
2.6
2.7
2.8
2.9
2.10 Flexible Motherboard Guidelines .......................................................................... 55
2.11 Reserved (RSVD) or Unused Signals .................................................................... 55
2.12 Test Access Port Connection ............................................................................... 55
2.13 Mixing Processors.............................................................................................. 55
2.14 Processor SPD Interface..................................................................................... 55
3
Processor Package Mechanical Specifications.......................................................... 57
3.1
Package Mechanical Specifications....................................................................... 57
3.1.1 Package Mechanical Drawing.................................................................... 58
3.1.2 Processor Component Keep-Out Zones...................................................... 61
3.1.3 Package Loading Specifications ................................................................ 61
3.1.4 Package Handling Guidelines.................................................................... 61
3.1.5 Package Insertion Specifications............................................................... 61
3.1.6 Processor Mass Specification.................................................................... 62
3.1.7 Processor Materials................................................................................. 62
3.1.8 Processor Markings................................................................................. 62
3.1.9 Processor Land Coordinates..................................................................... 63
4
Pin Listing ............................................................................................................... 65
4.1
Processor Package Bottom Land Assignments........................................................ 65
4.1.1 Processor Pin List, Sorted by Socket Name ................................................ 65
4.1.2 Processor Pin List, Sorted by Land Number ................................................ 85
5
6
Signal Definitions .................................................................................................. 105
Thermal Specifications .......................................................................................... 111
6.1
6.2
Package Thermal Specifications......................................................................... 111
6.1.1 Thermal Specifications .......................................................................... 111
6.1.2 Thermal Metrology ............................................................................... 117
Processor Thermal Features.............................................................................. 118
6.2.1 Thermal Monitor Features...................................................................... 118
6.2.2 Intel® Thermal Monitor 1 ...................................................................... 118
Datasheet Volume 1 of 2
3
INTEL [ INTEL ]
