Thermal Specifications
applications. Intel has developed the thermal profile to allow customers to choose the
thermal solution and environmental parameters that best suit their platform
implementation.
The 105W TDP Intel Xeon Processor E7-8800/4800/2800 Product Families processor
(see Figure 6-2; Table 6-3) and 95W TDP Intel Xeon Processor E7-8800/4800/2800
Product Families processor (see Figure 6-3; Table 6-4) support a single Thermal Profile.
The Thermal Profiles are indicative of a constrained thermal environment. Utilization of
a thermal solution that does not meet the Thermal Profile will violate the thermal
specifications and may result in permanent damage to the processor.
The upper point of the thermal profile consists of the Thermal Design Power (TDP) and
the associated TCASE_MAX value. It should be noted that the upper point associated with
the 130W TDP Intel Xeon Processor E7-8800/4800/2800 Product Families processor
Thermal Profile (x = TDP and y = TCASE_MAX P @ TDP) represents a thermal solution
design point. In actuality the processor case temperature may not reach this value due
to TCC activation (see Figure 6-1 for the Performance Intel Xeon Processor E7-8800/
4800/2800 Product Families processor). The lower point of the thermal profile consists
of x = P_PROFILE_MIN and y = TCASE_MAX @ P_PROFILE_MIN. P_PROFILE_MIN is defined as the
processor power at which TCASE, calculated from the thermal profile, is equal to 69°C.
Analysis indicates that real applications are unlikely to cause the processor to consume
maximum power dissipation for sustained time periods. Intel recommends that
complete thermal solution designs target the Thermal Design Power (TDP) instead of
the maximum processor power consumption. The Intel® Thermal Monitor feature is
intended to help protect the processor in the event that an application exceeds the TDP
recommendation for a sustained time period. For more details on this feature, refer to
Section 6.2. To ensure maximum flexibility for future requirements, systems should be
designed to the Flexible Motherboard (FMB) guidelines, even if a processor with lower
power dissipation is currently planned. The Intel Thermal Monitor 1 or Intel Thermal
Monitor 2 feature must be enabled for the processor to remain within its specifications.
Table 6-1.
Processor Thermal Specifications
Thermal
Design Power
(W)
Core
Frequency
Minimum
TCASE (°C)
Maximum
TCASE (°C)
Notes
Processor Launch to FMB
Processor Launch to FMB
Processor Launch to FMB
130
105
95
5
5
5
See Figure 6-1; Table 6-2; 1, 2, 3, 4, 5
See Figure 6-2; Table 6-3; 1, 2, 3, 4, 5
See Figure 6-3; Table 6-4; 1, 2, 3, 4, 5
Notes:
1.
These values are specified at V
for all processor frequencies. Systems must be designed to ensure
CC_MAX
the processor is not to be subjected to any static V and I combination wherein V exceeds V at
specified I
CC
CC
CC
CC_MAX
.
CC
2.
3.
4.
5.
Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the
maximum power that the processor can dissipate. TDP is measured at maximum T
.
CASE
These specifications are based on pre-silicon estimates and simulations. These specifications may be
updated with characterized data from silicon measurements in a future release of this document.
Power specifications are defined at all VIDs found in Table 2-2. The Intel Xeon Processor E7-8800/4800/
2800 Product Families processor may be shipped under multiple VIDs for each frequency.
FMB, or Flexible Motherboard, guidelines provide a design target for meeting all planned processor
frequency requirements.
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