Thermal Specifications
Figure 6-1. 130W TDP Processor Thermal Profile
TBD
Notes:
1.
Thermal Profile is representative of a volumetrically unconstrained platform. Refer to Table 6-2 for discrete
points that constitute the thermal profile.
2.
Implementation of the Thermal Profile should result in virtually no TCC activation. Furthermore, utilization
of thermal solutions that do not meet processor Thermal Profile will result in increased probability of TCC
activation and may incur measurable performance loss. (See Section 6.2 for details on TCC activation.)
Refer to the Intel® Xeon® Processor 7500 Series and Intel® Xeon® Processor E7-8800/4800/2800
Product Families Thermal and Mechanical Design Guide for system and environmental implementation
details.
3.
Table 6-2.
130W TDP Processor Thermal Profile Table (Sheet 1 of 2)
Power (W)
T
(°C)
CASE_MAX
48.0
48.8
49.6
50.4
51.2
52.0
52.8
53.6
54.4
55.2
56.0
56.8
57.6
58.4
0
5
10
15
20
25
30
35
40
45
50
55
60
65
Datasheet Volume 1 of 2
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INTEL [ INTEL ]
