Thermal Specifications
Table 6-2.
130W TDP Processor Thermal Profile Table (Sheet 2 of 2)
Power (W)
T
(°C)
CASE_MAX
59.1
59.9
60.7
61.5
62.3
63.1
63.9
64.7
65.5
66.3
67.1
67.9
69.0
70
75
80
85
90
95
100
105
110
115
120
125
130
Figure 6-2. 105W TDP Processor Thermal Profile
70.0
65.0
TCASE_MAX is a thermal solution design point
TBD
60.0
55.0
50.0
45.0
40.0
Y = .179x + 45.2
Power [W]
Notes:
1.
Thermal Profile is representative of a volumetrically constrained platform. Refer to Table 6-3 for discrete
points that constitute the thermal profile.
2.
Implementation of the Thermal Profile should result in virtually no TCC activation. Furthermore, utilization
of thermal solutions that do not meet processor Thermal Profile will result in increased probability of TCC
activation and may incur measurable performance loss. (See Section 6.2 for details on TCC activation.)
Refer to the Intel® Xeon® Processor 7500 Series and Intel® Xeon® Processor E7-8800/4800/2800
Product Families Thermal and Mechanical Design Guide for system and environmental implementation
details.
3.
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Datasheet Volume 1 of 2