Boxed Processor Specifications
7.2
Mechanical Specifications
7.2.1
Boxed Processor Cooling Solution Dimensions
This section describes the mechanical specifications of the boxed Pentium 4 processor on
0.13 micron process. The boxed processor will be shipped with an unattached fan heatsink.
Figure 7-1 shows a mechanical representation of the boxed Pentium 4 processor on 0.13 micron
process.
Clearance is required around the fan heatsink to ensure unimpeded airflow for proper cooling. The
physical space requirements and dimensions for the boxed processor with assembled fan heatsink
are shown in Figure 7-2 (Side Views), and Figure 7-3 (Top View). The airspace requirements for
the boxed processor fan heatsink must also be incorporated into new motherboard and system
designs. Airspace requirements are shown in Figure 7-6 and Figure 7-7. Note that some figures
have centerlines shown (marked with alphabetic designations) to clarify relative dimensioning.
Figure 7-2. Side View Space Requirements for the Boxed Processor
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Intel® Pentium® 4 Processor on 0.13 Micron Process Datasheet
INTEL [ INTEL ]
