Boxed Processor Specifications
Boxed Processor Specifications
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7.1
Introduction
The Pentium 4 processor on 0.13 micron process will also be offered as an Intel boxed processor.
Intel boxed processors are intended for system integrators who build systems from motherboards
and standard components. The boxed Pentium 4 processor on 0.13 micron process will be supplied
with a cooling solution. This chapter documents motherboard and system requirements for the
cooling solution that will be supplied with the boxed Pentium 4 processor on 0.13 micron process
This chapter is particularly important for OEMs that manufacture motherboards for system
integrators. Unless otherwise noted, all figures in this chapter are dimensioned in millimeters and
inches [in brackets]. Figure 7-1 shows a mechanical representation of a boxed Pentium 4 processor
on 0.13 micron process.
Note: Drawings in this section reflect only the specifications on the Intel boxed processor product. These
dimensions should not be used as a generic keep-out zone for all cooling solutions. It is the system
designer's responsibility to consider their proprietary cooling solution when designing to the
required keep-out zone on their system platform and chassis. Refer to the Intel® Pentium® 4
Processor with 512-KB L2 Cache on 0.13 Micron Process Thermal Design Guidelines for further
guidance.
Figure 7-1. Mechanical Representation of the Boxed Processor
NOTE: The airflow is into the center and out of the sides of the fan heatsink.
Intel® Pentium® 4 Processor on 0.13 Micron Process Datasheet
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INTEL [ INTEL ]
