Boxed Processor Specifications
7.4
Thermal Specifications
This section describes the cooling requirements of the fan heatsink solution utilized by the boxed
processor.
7.4.1
Boxed Processor Cooling Requirements
The boxed processor may be directly cooled with a fan heatsink. However, meeting the processor's
temperature specification is also a function of the thermal design of the entire system, and is
ultimately the responsibility of the system integrator. The processor temperature specification is
found in Chapter 5. The boxed processor fan heatsink is able to keep the processor temperature
within the specifications (see Table 5-1) in chassis that provide good thermal management. For the
boxed processor fan heatsink to operate properly, it is critical that the airflow provided to the fan
heatsink be unimpeded. Airflow is into the center and out of the sides of the fan heatsink. Airspace
is required around the fan to ensure that the airflow through the fan heatsink is not blocked.
Blocking the airflow to the fan heatsink reduces the cooling efficiency and decreases fan life.
Figure 7-6 and Figure 7-7 illustrate an acceptable airspace clearance for the fan heatsink. The air
temperature entering the fan should be kept below 40 °C. Again, meeting the processor's
temperature specification is the responsibility of the system integrator.
Figure 7-6. Boxed Processor Fan Heatsink Airspace Keep-Out Requirements (Side 1 View)
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Intel® Pentium® 4 Processor on 0.13 Micron Process Datasheet
INTEL [ INTEL ]
