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298643-012 参数 Datasheet PDF下载

298643-012图片预览
型号: 298643-012
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内容描述: 英特尔®奔腾® 4处理器至尊版支持超线程技术 [Intel Pentium 4 Processor Extreme Edition Supporting Hyper-Threading Technology]
分类和应用:
文件页数/大小: 85 页 / 1758 K
品牌: INTEL [ INTEL ]
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Features  
6.2.5  
Sleep State—State 5  
The Sleep state is a very low power state in which the processor maintains its context, maintains  
the phase-locked loop (PLL), and has stopped all internal clocks. The Sleep state can be entered  
only from Stop-Grant state. Once in the Stop-Grant state, the processor will enter the Sleep state  
upon the assertion of the SLP# signal. The SLP# pin should be asserted only when the processor is  
in the Stop-Grant state. SLP# assertions while the processor is not in the Stop-Grant state is out of  
specification, and may result in unapproved operation.  
Snoop events that occur while in Sleep State or during a transition into or out of Sleep state will  
cause unpredictable behavior.  
In the Sleep state, the processor is incapable of responding to snoop transactions or latching  
interrupt signals. No transitions or assertions of signals (with the exception of SLP# or RESET#)  
are allowed on the system bus while the processor is in Sleep state. Any transition on an input  
signal before the processor has returned to Stop-Grant state will result in unpredictable behavior.  
If RESET# is driven active while the processor is in the Sleep state and is held active as specified  
in the RESET# pin specification, the processor will reset itself, ignoring the transition through  
Stop-Grant State. If RESET# is driven active while the processor is in the Sleep State, the SLP#  
and STPCLK# signals should be deasserted immediately after RESET# is asserted to ensure that  
the processor correctly executes the Reset sequence.  
Once in the Sleep state, the SLP# pin must be de-asserted if another asynchronous system bus  
event needs to occur. The SLP# pin has a minimum assertion of one BCLK period.  
When the processor is in Sleep state, it will not respond to interrupts or snoop transactions.  
6.3  
Thermal Monitor  
The Thermal Monitor feature helps control the processor temperature by activating the Thermal  
Control Circuit (TCC) when the processor silicon reaches its maximum operating temperature. The  
TCC reduces processor power consumption by modulating (starting and stopping) the internal  
processor core clocks. The Thermal Monitor feature must be enabled for the processor to be  
operating within specifications. The temperature at which Thermal Monitor activates the thermal  
control circuit is not user configurable and is not software visible. Bus traffic is snooped in the  
normal manner, and interrupt requests are latched (and serviced during the time that the clocks are  
on) while the TCC is active.  
When the Thermal Monitor feature is enabled, and a high temperature situation exists (i.e., TCC is  
active), the clocks will be modulated by alternately turning the clocks off and on at a duty cycle  
specific to the processor (typically 30–50%). Clocks often will not be off for more than 3.0 µs  
when the TCC is active. Cycle times are processor speed dependent and will decrease as processor  
core frequencies increase. A small amount of hysteresis has been included to prevent rapid active/  
inactive transitions of the TCC when the processor temperature is near its maximum operating  
temperature. Once the temperature has dropped below the maximum operating temperature, and  
the hysteresis timer has expired, the TCC goes inactive and clock modulation ceases.  
With a properly designed and characterized thermal solution, it is anticipated that the TCC would  
only be activated for very short periods of time when running the most power intensive  
applications. The processor performance impact due to these brief periods of TCC activation is  
expected to be so minor that it would be immeasurable. An under-designed thermal solution that is  
not able to prevent excessive activation of the TCC in the anticipated ambient environment may  
74  
Intel® Pentium® 4 Processor on 0.13 Micron Process Datasheet