Thermal Specifications and Design Considerations
NOTES:
1. These values are specified at VCC_MAX for the processor. Systems must be designed to ensure that the
processor is not subjected to any static VCC and ICC combination wherein VCC exceeds VCC_MAX at specified
I
CC. Refer to loadline specifications in Chapter 2.
2. The numbers in this column reflect Intel’s recommended design point and are not indicative of the maximum
power the processor can dissipate under worst case conditions. For more details, refer to the
®
®
Intel Pentium 4 Processor with 512-KB L2 Cache on 0.13 Micron Process Thermal Design Guidelines.
3. TDP and TC are specified for highest VID only. Processors will be shipped under multiple VIDs for each
frequency; however, the TDP and TC specifications will be the same as highest VID specified in the table.
5.1.2
Thermal Metrology
5.1.2.1
Processor Case Temperature Measurement
The maximum and minimum case temperature (TC) for the Pentium 4 processor on 0.13 micron
process is specified in Table 5-1. This temperature specification is meant to help ensure proper
operation of the processor. Figure 5-2 illustrates where Intel recommends TC thermal
measurements should be made. For detailed guidelines on temperature measurement methodology,
refer to the Intel® Pentium® Processor 4 with 512-KB L2 Cache on 0.13 Micron Process Thermal
Design Guidelines.
Figure 5-2. Guideline Locations for Case Temperature (TC) Thermocouple Placement
0.689”
17.5 mm
Measure Tcase
At this point
0.689”
17.5 mm
35 mm Package
Thermal Interface
Material should cover the
entire surface of the
70
Intel® Pentium® 4 Processor on 0.13 Micron Process Datasheet
INTEL [ INTEL ]
