E
CONTENTS
PAGE
1.0 INTRODUCTION ............................................ 7
1.1 Product Overview ........................................ 7
2.0 DEVICE PINOUT........................................... 10
2.1 Lead Descriptions ...................................... 12
3.0 MEMORY MAPS ........................................... 14
3.1 Extended Status Register Memory Map..... 15
4.0 BUS OPERATIONS, COMMANDS AND
STATUS REGISTER DEFINITIONS............. 16
4.1 Bus Operations for Word-Wide Mode
(BYTE# = V
IH
)........................................... 16
4.2 Bus Operations for Byte-Wide Mode
(BYTE# = V
IL
) ........................................... 17
4.3 28F008SA—Compatible Mode Command
Bus Definitions.......................................... 18
4.4 28F016XS—Enhanced Command Bus
Definitions ................................................. 19
4.5 Compatible Status Register ....................... 20
4.6 Global Status Register ............................... 21
4.7 Block Status Register ................................ 22
4.8 Device Configuration Code ........................ 23
4.9 SFI Configuration Table ............................. 23
28F016XS FLASH MEMORY
PAGE
5.0 ELECTRICAL SPECIFICATIONS ................. 24
5.1 Absolute Maximum Ratings ....................... 24
5.2 Capacitance............................................... 24
5.3 Transient Input/Output Reference
Waveforms............................................... 26
5.4 DC Characteristics (V
CC
= 3.3V) ................ 27
5.5 DC Characteristics (V
CC
= 5.0V) ................ 30
5.6 Timing Nomenclature ................................. 33
5.7 AC Characteristics—Read Only
Operations ................................................ 34
5.8 AC Characteristics for WE#—Controlled
Write Operations ....................................... 40
5.9 AC Characteristics for CE X#—Controlled
Write Operations ....................................... 44
5.10 Power-Up and Reset Timings .................. 48
5.11 Erase and Program Performance............. 49
6.0 MECHANICAL SPECIFICATIONS ................ 51
APPENDIX A: Device Nomenclature and
Ordering Information .................................. 53
APPENDIX B: Additional Information............... 54
3
INTEL [ INTEL CORPORATION ]
