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253668 参数 Datasheet PDF下载

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型号: 253668
PDF下载: 下载PDF文件 查看货源
内容描述: 双核英特尔​​®至强®处理器 [Dual-Core Intel Xeon Processor]
分类和应用:
文件页数/大小: 104 页 / 3687 K
品牌: INTEL [ INTEL ]
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Thermal Specifications  
Figure 6-2; Table 6-3 and Table 6-6) is indicative of a constrained thermal environment  
(that is, 1U form factor). Because of the reduced cooling capability represented by this  
thermal solution, the probability of TCC activation and performance loss is increased.  
Additionally, utilization of a thermal solution that does not meet Thermal Profile B will  
violate the thermal specifications and may result in permanent damage to the  
processor. Intel has developed these thermal profiles to allow OEMs to choose the  
thermal solution and environmental parameters that best suit their platform  
implementation. Refer to the Dual-Core Intel® Xeon® Processor 5000 Series Thermal/  
Mechanical Design Guidelines for details on system thermal solution design, thermal  
profiles and environmental considerations.  
The Dual-Core Intel Xeon Processor 5063 (MV) supports a single Thermal Profile  
targeted at volumetrically constrained thermal environments (for example, blades, 1U  
form factors.) With this Thermal Profile, it’s expected that the Thermal Control Circuit  
(TCC) would only be activated for very brief periods of time when running the most  
power-intensive applications. Refer to the Dual-Core Intel® Xeon® Processor 5000  
Series Thermal/Mechanical Design Guidelines for further details.  
The upper point of the thermal profile consists of the Thermal Design Power (TDP)  
defined in Table 6-1, Table 6-4, Table 6-7 and the associated TCASE value. It should be  
noted that the upper point associated with Thermal Profile B (x = TDP and y =  
TCASE_MAX_B @ TDP) represents a thermal solution design point. In actuality the  
processor case temperature will not reach this value due to TCC activation (refer to  
Figure 6-1 and Figure 6-2). The lower point of the thermal profile consists of x =  
P_profile_min and y = TCASE_MAX @ P_profile_min. P_profile_min is defined as the  
processor power at which TCASE , calculated from the thermal profile, is equal to 50 °C.  
The case temperature is defined at the geometric top center of the processor IHS.  
Analysis indicates that real applications are unlikely to cause the processor to consume  
maximum power dissipation for sustained time periods. Intel recommends that  
complete thermal solution designs target the Thermal Design Power (TDP) indicated in  
Table 6-1, Table 6-4 and Table 6-7, instead of the maximum processor power  
consumption. The Thermal Monitor feature is intended to help protect the processor in  
the event that an application exceeds the TDP recommendation for a sustained time  
period. For more details on this feature, refer to Section 6.2. To ensure maximum  
flexibility for future requirements, systems should be designed to the Flexible  
Motherboard (FMB) guidelines, even if a processor with lower power dissipation is  
currently planned. The Thermal Monitor feature must be enabled for the  
processor to remain within its specifications.  
Table 6-1.  
Dual-Core Intel Xeon Processor 5000 Series (1066 MHz) Thermal  
Specifications  
Thermal  
Design Power  
(W)  
Minimum  
TCASE  
(°C)  
Maximum TCASE  
(°C)  
Core Frequency  
Notes  
Launch to FMB  
130  
5
Refer to Figure 6-1; Table 6-2; Table 6-3 1, 2, 3, 4, 5  
Notes:  
1.  
These values are specified at V  
for all processor frequencies. Systems must be designed to ensure  
CC_MAX  
the processor is not to be subjected to any static V and I combination wherein V exceeds V at  
CC  
CC  
CC  
CC_MAX  
specified I . Please refer to the loadline specifications in Chapter 2, “Electrical Specifications”.  
CC  
2.  
Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the  
maximum power that the processor can dissipate. TDP is measured at maximum T  
These specifications are based on final silicon validation/characterization.  
Power specifications are defined at all VIDs found in Table 2-10. The Dual-Core Intel Xeon Processor 5000  
series may be shipped under multiple VIDs for each frequency.  
FMB, or Flexible Motherboard, guidelines provide a design target for meeting all planned processor  
frequency requirements.  
.
CASE  
3.  
4.  
5.  
70  
Dual-Core Intel® Xeon® Processor 5000 Series Datasheet  
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