Thermal Specifications
Table 6-6.
Dual-Core Intel Xeon 5000 Series (667 MHz) Thermal Profile B Table
Power (W)
T
(° C)
Power (W)
T
(° C)
CASE_MAX
50.0
CASE_MAX
61.8
P_profile_min =29.6
_B
75
80
85
90
95
35
40
45
50
55
60
65
70
51.4
63.1
52.7
64.4
54.0
65.7
55.3
67.0
56.6
57.9
59.2
60.5
Table 6-7.
Dual-Core Intel Xeon Processor 5063 (MV) Thermal Specifications
Thermal
Core Frequency Design Power
(W)
Minimum
TCASE
(°C)
Maximum TCASE
(°C)
Notes
Launch to FMB
95
5
Refer to Figure 6-3;
Table 6-8
1, 2, 3, 4,
5
Notes:
1.
These values are specified at V
for all processor frequencies. Systems must be designed to ensure
CC_MAX
the processor is not to be subjected to any static V and I combination wherein V exceeds V at
CC
CC
CC
CC_MAX
specified I . Please refer to the loadline specifications in Chapter 2, “Electrical Specifications.”
CC
2.
Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the
maximum power that the processor can dissipate. TDP is measured at maximum T
These specifications are based on final silicon validation/characterization.
Power specifications are defined at all VIDs found in Table 2-10. The Dual-Core Intel Xeon Processor 5000
series may be shipped under multiple VIDs for each frequency.
FMB, or Flexible Motherboard, guideline provide a design target for meeting all planned processor
frequency requirements.
.
CASE
3.
4.
5.
74
Dual-Core Intel® Xeon® Processor 5000 Series Datasheet
INTEL [ INTEL ]
