欢迎访问ic37.com |
会员登录 免费注册
发布采购

253668 参数 Datasheet PDF下载

253668图片预览
型号: 253668
PDF下载: 下载PDF文件 查看货源
内容描述: 双核英特尔​​®至强®处理器 [Dual-Core Intel Xeon Processor]
分类和应用:
文件页数/大小: 104 页 / 3687 K
品牌: INTEL [ INTEL ]
 浏览型号253668的Datasheet PDF文件第65页浏览型号253668的Datasheet PDF文件第66页浏览型号253668的Datasheet PDF文件第67页浏览型号253668的Datasheet PDF文件第68页浏览型号253668的Datasheet PDF文件第70页浏览型号253668的Datasheet PDF文件第71页浏览型号253668的Datasheet PDF文件第72页浏览型号253668的Datasheet PDF文件第73页  
Thermal Specifications  
6 Thermal Specifications  
6.1  
Package Thermal Specifications  
The Dual-Core Intel Xeon Processor 5000 series require a thermal solution to maintain  
temperatures within its operating limits. Any attempt to operate the processor outside  
these operating limits may result in permanent damage to the processor and  
potentially other components within the system. As processor technology changes,  
thermal management becomes increasingly crucial when building computer systems.  
Maintaining the proper thermal environment is key to reliable, long-term system  
operation.  
A complete solution includes both component and system level thermal management  
features. Component level thermal solutions can include active or passive heatsinks  
attached to the processor integrated heat spreader (IHS). Typical system level thermal  
solutions may consist of system fans combined with ducting and venting.  
This section provides data necessary for developing a complete thermal solution. For  
more information on designing a component level thermal solution, refer to the Dual-  
Core Intel® Xeon® Processor 5000 Series Thermal/Mechanical Design Guidelines.  
Note:  
The boxed processor will ship with a component thermal solution. Refer to Chapter 8,  
“Boxed Processor Specifications”for details on the boxed processor.  
6.1.1  
Thermal Specifications  
To allow the optimal operation and long-term reliability of Intel processor-based  
systems, the processor must remain within the minimum and maximum case  
temperature (TCASE) specifications as defined by the applicable thermal profile (refer to  
Table 6-1, Table 6-4 and Table 6-7; Figure 6-1, Figure 6-2 and Figure 6-3). Thermal  
solutions not designed to provide this level of thermal capability may affect the long-  
term reliability of the processor and system. For more details on thermal solution  
design, please refer to the processor thermal/mechanical design guidelines.  
The Dual-Core Intel Xeon Processor 5000 series implement a methodology for  
managing processor temperatures, which is intended to support acoustic noise  
reduction through fan speed control and to ensure processor reliability. Selection of the  
appropriate fan speed is based on the temperature reported by the processor’s Thermal  
Diode. If the diode temperature is greater than or equal to Tcontrol (refer to  
Section 6.2.6), then the processor case temperature must remain at or below the  
temperature specified by the thermal profile (refer to Figure 6-1, Figure 6-2 and  
Figure 6-3). If the diode temperature is less than Tcontrol, then the case temperature  
is permitted to exceed the thermal profile, but the diode temperature must remain at  
or below Tcontrol. Systems that implement fan speed control must be designed to take  
these conditions into account. Systems that do not alter the fan speed only need to  
guarantee the case temperature meets the thermal profile specifications.  
Intel has developed two thermal profiles, either of which can be implemented with the  
Dual-Core Intel Xeon Processor 5000 series. Both ensure adherence to Intel reliability  
requirements. Thermal Profile A (refer to Figure 6-1, Figure 6-2; Table 6-2 and  
Table 6-5) is representative of a volumetrically unconstrained thermal solution (that is,  
industry enabled 2U heatsink). In this scenario, it is expected that the Thermal Control  
Circuit (TCC) would only be activated for very brief periods of time when running the  
most power intensive applications. Thermal Profile B (refer to Figure 6-1 and  
Dual-Core Intel® Xeon® Processor 5000 Series Datasheet  
69  
 复制成功!