Intel
®
Cyclone
®
10 LP Device Overview
C10LP51001 | 2020.05.21
Intel Cyclone 10 LP Available Options
Figure 1.
Sample Ordering Code and Available Options for Intel Cyclone 10 LP Devices
—Preliminary
Package Type
F
E
U
M
L : LP
:
:
:
:
FineLine BGA (FBGA)
Enhanced Thin Quad Flat Pack (EQFP)
Ultra FineLine BGA (UBGA)
Micro FineLine BGA (MBGA)
Operating Temperature
C : Commercial (T
J
= 0°C to 85°C)
I : Industrial (T
J
= -40°C to 100°C)
Extended Industrial (T
J
= -40°C to 125°C)
A : Automotive (T
J
= -40°C to 125°C)
Family Variant
Family Signature
10C : Cyclone 10
10C
L
120
Z
F
780
I
8
GES
Optional Suffix
Member Code
006 :
010 :
016 :
025 :
040 :
055 :
080 :
120 :
6,272 logic elements
10,320 logic elements
15,408 logic elements
24,624 logic elements
39,600 logic elements
55,856 logic elements
81,264 logic elements
119,088 logic elements
Core Voltage
Y : Standard voltage (1.2 V)
Z : Lower core voltage (1.0 V)
FPGA Fabric
Speed Grade
6 (fastest)
7
8
Indicates specific device
options or shipment method
G : RoHS6-compliant packaging
ES : Engineering sample
Package Code
FBGA Package Type
484 : 484 pins
780 : 780 pins
EQFP Package Type
144 : 144 pins
UBGA Package Type
256 : 256 pins
484 : 484 pins
MBGA Package Type
164 : 164 pins
Related Information
Lists the ordering part number of devices that support the extended industrial
operating temperature, the devices' operational speed grade, and Intel Quartus
Prime option to set for performing timing analysis at the extended junction
temperature range.
Intel
®
Cyclone
®
10 LP Device Overview
5
INTEL [ INTEL CORPORATION ]
