TDA5235
Reference
#
Parameter
Symbol
Limit Values
Unit Test Conditions
Remarks
min. typ. max.
Crystal Oscillator Characteristics
21.948
717
H1
Frequency range
fXTAL
MHz
fF
H2
Crystal parameters
H2.1
Motional
C1
3
6
10
■
capacitance
H2.2
H2.3
H2.4
H2.5
Motional resistance
Shunt capacitance
Load capacitance
R1
18
2
80
4
Ω
■
■
■
■
C0
pF
pF
ppm
CLoad
fXTAL_Tol
12
nominal value
Initial frequency
tolerance
-30
-50
+30
oscillator untrimmed (trim
capacitor default settings,
usage of recommended
crystal);
not including crystal
tolerances
H2.6
H2.7
H3
Frequency trimming ΔfXTAL
range
+50
4
ppm
ppm
Hz
larger trimming range
possible via SD PLL
Trimming step
ΔfX_step
1
see also step size of
SD PLL
■
■
Clock output
frequency at PPx pin
fclock_out
11
5.5M
292
10pF load
H4
Crystal oscillator
settling time
tCOSCsettle
292
292
µs
(switching from Low
Power to High
Precision Mode)
H5
Start up time
tstart_up
0.45
1
ms
crystal type:
NDK NX5032SD;
See also BOM for ext.
load caps;
Note: No SPI
communication is allowed
before XOSC start-up is
finished and chip reset is
already finished
Data Sheet
143
V1.0, 2010-02-19
INFINEON [ Infineon ]
