IDT72T7285/72T7295/72T72105/72T72115 2.5V TeraSync
16,384 x 72, 32,768 x 72, 65,536 x 72, 131,072 x 72
72-BIT FIFO
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
2
1
RCLK
tENS
REN
RCS
tENS
tENS
tENS
tENH
tREF
tREF
EF
tRCSHZ
tRCSHZ
tA
tA
tRCSLZ
tRCSLZ
LAST DATA-1
LAST DATA
Q0 - Qn
tSKEW1(1)
WCLK
tENS
tENH
WEN
tDS
tDH
Dn
Dx
5994 drw18
NOTES:
1. tSKEW1 is the minimum time between a rising WCLK edge and a rising RCLK edge to guarantee that EF will go HIGH (after one RCLK cycle plus tREF). If the time between the
rising edge of WCLK and the rising edge of RCLK is less than tSKEW1, then EF deassertion may be delayed one extra RCLK cycle.
2. LD = HIGH.
3. First data word latency = tSKEW1 + 1*TRCLK + tREF.
4. OE is LOW.
Figure 13. Read Cycle and Read Chip Select (IDT Standard Mode)
35
IDT [ INTEGRATED DEVICE TECHNOLOGY ]
